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In this article, through the one-step selective area current blocking design without additional steps to form current blocking structure, we could define a Schottky contact region under the p-pad to avoid spontaneous emission beneath the opaque p-pad, thus enhancing an additional current injection into the effective active layers of the LED, thereby significantly increasing the light output power...
Thermal management and package materials in high power light emitting diodes (HPLEDs) are now critical design issues to limit their luminous intensity, reliability, and applications. In this paper electroless and electroplating techniques (EET) were both applied in fabrication of the red, green, and blue HPLEDs (RGB HPLEDs) chips. The HPLEDs with conventional package structures were fixed on the lead...
GaN-based light-emitting diodes (LEDs) with nanosphere layers were fabricated by spin-coating method. It was found that the LEDs with and without nanosphere layers had the same electrical characteristics. With 20 mA current injection, the luminance intensities of the LEDs with nanosphere layers of 300 nm and 500 nm diameters exceeded that of the LED without nanosphere layers by 5.72% and 9.05%, respectively...
GaN-based light-emitting diodes (LEDs) with an emitting wavelength of 450 nm were grown on nano-patterned sapphire substrates (NPSS) fabricated by nanosphere lithography. The crystalline quality of the epitaxial film could be improved by using the NPSS technique. The output power of LED grown on NPSS was 1.3 and 1.11 times higher than those of LEDs grown on conventional and patterned sapphire substrates...
Heat dissipation and thermal management of devices package are now a critical problem for applications of high power light emitting diodes (LEDs). In this paper, a novel package method with copper electroplating on the red, green, and blue LED chips were performed. With the copper plating layer, the endurable injection current of these LED chips can be increased easily from typical value of 350 mA...
The thermal management has become increasingly important when comes to device applications using ultra high power light emitting diodes (UHPLEDs). To thermally manage the devices in a most effective fashion, we report a novel packaging technique in which a copper electroplating process is directly applied over the red, green, and blue LED chips. With the copper-encapsulated layer, the operation current...
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