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This paper presents three different technology modules, integrated into a 0.13-μm SiGe BiCMOS process; namely RF-MEMS switch, microfluidics and heterogeneous integration technologies. The RF-MEMS switch module is optimized for mm-wave applications and offers superior performance figures at D-band with a wafer level encapsulated packaging option. The microfluidics module which is embedded by bonding...
Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are the substrate-less package, low thermal resistance, high RF performance due to shorter interconnects together, as the direct IC connection by thin film metallization...
La(Fe,Mn,Si)13Hx-based intermetallic compounds with field-induced first-order magnetic phase transition are one of the most promising materials for application in active magnetic refrigerators (AMR).
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies that also allow large area processing and 3D integration with strong potential for low cost applications. Here, Fan-Out Wafer Level Packaging [FOWLP] is one of the latest packaging trends in microelectronics. For FOWLP known good bare dies are embedded into mold compound...
Polymers are widely used in microelectronics packaging as e.g. adhesives or encapsulants. Low cost and mass production capabilities are the main advantages of these materials. But like all polymers they cannot provide a hermetical sealing due to their permeability properties. The susceptibility to diffusion of liquids and gases through the polymer and along the interfaces is a drawback for polymers...
Summary This paper presents a practical course that introduces students to the development and construction of a mobile robotic system. Using a wheeled climbing robot for metallic walls as an example, the course aims at teaching practical skills in engineering as well as developing soft skills like project management and teamwork. To increase motivation and allow the construction of a working system...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. For FOWLP known good bare dies are embedded into mold compound forming a reconfigured wafer. A thin film redistribution layer is applied on the reconfigured wafer routes the die pads to the space around the die on the mold compound (fan-out). After solder ball placement and package singulation by dicing...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology offers not only solutions for single chip packaging but also approaches for 3D system integration or RF suitable packaging. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics for heterogeneous system integration. This paper describes the technological path from wafer level embedding to 24"×18" fan-out panel level packaging technology in combination with low cost PCB based RDL processes and discusses challenges and opportunities in detail. The technology described offers...
Today, there is no non-destructive, simple, inexpensive and yet accurate in-situ monitoring technique for cracks and delamination available for routine use in electronic package testing. However, such a method is highly desirable, as delamination testing is part of every qualification programme in industry. Rapid failure analytical techniques which allow introspect and easy-to-interpret information...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12″/300 mm diameter. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12”/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size of...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
General lighting by use of LED-Chips is one of the strongly growing markets today and also in future. One of the trends goes to LEDs with higher and higher luminous fluxes per chip area to get the best price per lumen on the market. Unfortunately, such large LEDs produce a lot of heat, which must be spread to avoid overheating and shorter lifetime of the LEDs. Another approach is the use of many small...
Microelectronic components are introduced to an increasing number of applications as part of a controlling or monitoring device, as sensors or as means to tracking. Depending on the application, extreme loading profiles may need to be endured such as high temperatures, random vibrations or humid and even wet environments. Absorbed moisture has a plasticizing effect on the physical properties of polymers...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-inPolymer) are two major packaging trends in this area. Mold embedding...
One of the most prominent failure modes in microelectronics devices is the delamination of epoxy materials (adhesives, molding compounds). The thermal mismatch at the interface between materials leads to stresses that build up during processing steps at different temperatures and in the following thermal cycling through use of the device or reliability testing. These stresses arc well understood and...
We have investigated the capability to predict moisture induced swelling of an epoxy by use of molecular dynamics in combination with finite element simulations with well agreeing results. Some open questions remain regarding reproducability, structural validity of molecular models and equilibrium conditions and structural acuracy and influence on the results, which will be subject of future investigations...
With the increasing market of handheld electronics e.g. smartphones and tablet PCs also an increasing demand for highly miniaturized multi-sensor packages shows up. One application scenario here would be an electronic compass allowing indoor navigation in complex buildings with a smartphone. These applications of highly miniaturized heterogeneous system integration lead to a need for new packaging...
In this paper, we present the application of a substrateless packaging technology consisting of sub sequential molding of ASIC and MEMS dice und forming redistribution layers (RDL) on the molding compound. Acceleration sensors and pressure sensors were packaged, each sensor type presenting its own challenges. For pressure sensors it is crucial to ensure the access of the surrounding media to the pressure...
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