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Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performance of physical TiO2 and TaO2 nonvolatile memristive devices were compared in terms of switching speed, retention and endurance. TaO2 memristive devices have shown better endurance (108 times more switching cycles) and...
The welding quality in the form of nugget diameter and the tensile strength of resistance spot welding in low carbon steel was experimentally investigated. Two types of low carbon steel; the uncoated plate of SPC 270D and the coated plate of SCGA 270D with the same thickness of 0.7 mm were used and studied in this experiment. The process determination of optimal welding conditions was done based on...
A bearing is a machine element used to constrain relative motion and reduces friction between moving parts with necessary lubrication provided. Bi-metal aluminium bearing manufacturers say their products offer long-term durability, dry-start protection, resistance to debris, corrosion resistance and dimensional accuracy for stock and light duty, as well as performance and racing, applications. The...
The source of electrons reliably operating in this pressure range is required to develop a wide-gauge vacuummeter (10−7−760 mm Hg). In this paper results of the study of photoemission from the surface of different materials under the impact of UV LED sources with wavelengths of 260 and 280 nm are shown.
Lifetime of most vacuum and gas-discharge switching devices is determined primarily by electroerosion resistance of electrodes manufactured from refractory materials — molybdenum, tungsten, etc. Low thermal conductivity and electrical conductivity of these materials contribute to an undesirable increase of temperature of the electrodes surface. In this paper the calculation results of characteristics...
The present work discusses the preliminary results of the proposed indirect porosity measurement methodology. Such methodology makes use of the electrical parameters of Spark Plasma Sintering (SPS) process in order to relate the resistance of a metallic foam sample with its porosity. In order to produce biomimetic orthopedic implants, magnesium foams with open interconnected porosity have been identified...
The Prandtl-Ishlinskii (PI) model is a popular hysteresis model that has been widely adopted for smart material-based systems. Recently, an analytical inversion of a generalized PI model was formulated, facilitating the modeling and control of systems with hysteresis. The approach, however, does not allow the inclusion of a memoryless nonlinearity. In this paper we consider an extended generalized...
The conventional design of belt conveyor systems usually focuses on their mechanical parameters. In this paper, this design is reconsidered aiming at an improved energy efficiency. To this end, it is essential to consider the entire electromechanical system — from the belt to the electrical power supply. All these system components are modeled in order to estimate the losses at various operating points...
Nanoscale resistive switching devices are nowadays widely employed in applications of storage, logic and computing. The switching mechanism of metal oxide based devices is normally assumed to be the filamentary formation and rupture within the devices' active cores but the origin of filaments growth is still controversial. Previous research has already demonstrated that initial filamentary states...
We engineer a scalable and CMOS-friendly RRAM stack using down to 3nm ALD-based Ta2O5. The 20nm-sized TiN\Ta2O5\Ta device operated at 50µA exhibits ultra-fast write (∲5ns) at moderate voltage (<2V) with >109 write endurance. We also demonstrate excellent disturb and retention characteristics, which we relate to the appropriate tuning of the oxygen chemical-potential profile along the filament...
In this paper, 5Xnm cross point cell array for the low power ReRAM operation was developed with 1S1R cell structure. Through the optimization of both TiOx/TaOx based-1R and NbO2 based-1S stacks with TiN based-electrode, the world's first and best bipolar switching characteristics with the lowest operation current (20∼50uA) and sneak current (∼1uA) level were acquired.
Hybrid memory systems that incorporate Storage Class Memory (SCM) as non-volatile cache or DRAM data backup are expected to bolster system efficiency and cost because SCM promises higher density than DRAM cache and higher speed than the storage I/F. This paper demonstrates a Cu-based resistive random access memory (ReRAM) cell that meets the SCM performance specifications for a 16Gb ReRAM with 200MB/s...
Aostract is ReRAM mereasmgiy being developed for applications that require higher speeds and lower voltages than flash memory. We have found TaOx to have high performance and high reliability. However one of the phenomena observed in ReRAM is that each resistance after Set and Reset varies during every cycle. To stabilize resistive switching, the key is to limit these variations in resistance. In...
Effects of AlOx interfacial layer in the W/AlOx/TaOx/TiN structures have been investigated for the first time. This RRAM device shows long endurance of 106 cycles and good retention at 85°C for a low current compliance of 100 μA. A physics based simulation is studied to understand the set and reset mechanism of RRAM. The nature of ions migration, potential profile and temperature of filament during...
We prepared CNT based vias on wafer scale. Based on the electrical characterization we extracted the localization length of the CNTs. While for short CNTs the classical transport regime is valid, the Anderson localization regime applies for longer CNTs. Supplementary the characteristic length scales were estimated based on the structure of the CNTs being in good agreement with the parameters extracted...
In this paper, Ni-coated graphene nanosheets (GNS-Ni) were synthesized by an in situ chemical reduction method. Such GNS-Ni sheets, by varying their weight fractions (0.05, 0.1 and 0.2wt.%) were successfully incorporated into the SAC305 solder matrix to fabricate composite solders through the powder metallurgy processing method. The samples of composite solders were then investigated in terms of their...
NiCu is one of the widely used thin-film materials, which is now commonly used as sensor and resistor in very-large-scale-integration (VLSI) because of its high resistivity and stability. However, with the scale decreasing and the temperature increasing in service condition, the limited reliability of NiCu thin-film material has been a key issue in microelectronics and packaging industry mainly due...
In orthopedic surgery, bone-cutting procedures are frequently performed. However, bone-cutting procedures are very risky in cases where vital organs or nerves exist beneath the target bones. In such cases, surgeons are required to determine the depth of the penetration into the bone by using only their haptic senses. Thus, we developed a handheld bone-cutting-tool system that detects the penetration...
For 2.5D and 3D IC packaging, wafer back side processing often has temperature limits substantially lower than curing temperature of conventional polyimide (PI). New low temperature curable insulation materials possess very different properties and require thorough evaluation to ensure process compatibility and product reliability. In this work, we present a set of evaluation methods that can be used...
This paper introduces a process used to produce stable and reliable Cu-Al joints with a high degree of freedom regarding component geometries. The process uses the accurate controllable energy input of the beam processes (electron- or laser beam) and the difference of the fusion temperature of the two materials. The paper shows the problems and the state of the art of joining copper and aluminium;...
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