The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Taking the advantage of the thermo-elastic effect, while using an infrared camera system, the mechanical stress could be made visible. The stress concentrations at the tip of a subcritical crack growth could clearly be detected. Through the observation during the periodic loading of a CT-specimen the crack growth rate can be determined. For this purpose, a specially developed loading stage will be...
Novel approach to improve light extraction efficiency of InGaN-based light emitting diodes with polydimethylsiloxane concave microstructures arrays was demonstrated, which leads to enhancement of extraction efficiency by 1.60-times in good agreement with simulation.
There is an ever-growing need in the electronics packaging industry for high performance, polymer-based materials having increased electrical and thermal conductivity. All too often the steps taken to reach higher conductivities are accompanied by undesirable property tradeoffs such as reduced adhesion, compliance, and toughness and increased viscosity. In certain cases, fundamental physical limitations...
This paper presents a new method using a polymer material to generate optically-induced dielectrophoretic (ODEP) forces for particle manipulation. Instead of using the common material such as amorphous silicon, a polymer (P3HT/PCBM) which has excellent light absorption, was used in this study. Without using delicate and high-temperature thin-film process, the entire fabrication process was performed...
This paper presents a system for wirelessly monitoring the accumulation of sludge within biliary stents. The system comprises a sensor and biasing permanent magnet layer that conform to the meshed topology and tubular curvature of a biliary stent. The sensors have an active area of 7.5 mm times 29 mm and a mass of 9.1 mg. Annealing the sensor at 375degC results in reducing the required biasing magnetic...
In this paper, we describe a modification of the classical hot embossing process which is capable of producing holes in polymer substrates. Substrates with holes that penetrate the complete height of the substrate have been a technical challenge since the first description of the hot embossing process. However most components as, e. g., microfluidic components targeted for biomedical applications...
Nanofibers will be of great use in tissue engineering, filtration, protective clothing and micro/nano devices etc. In this paper a facile method is introduced to traditional electrospinning to deposit patterned nanofibers to expand its applications, in which three types of parallel top-bottom configurations of two different materials, that is, plastic (polyethylene terephthalate, PET)-glass, plastic-copper...
This paper presents a RF MEMS switch with a new ruthenium/gold multi-layer contact metallization scheme, which combines the advantages of a hard ruthenium contact surface for high contact reliability and of a low, total contact resistance as typical for gold alloys. The performance of the new concept has been analyzed theoretically and was experimentally verified by contact resistance and life-time...
This paper describes an integration method of bridging-structural single-walled carbon nanotubes (SWNTs) onto the flexible PDMS sheet by stamping transfer. Silicon microstructures and the SWNTs which directly synthesized between the gaps of the microstructures were lifted off by PDMS stamp sheets with high yield (97.8%) and accuracy (position error <100 nm). From the SEM observation of our transferred...
Bismaleimides with three prepolymer molecular weights were synthesized and fabricated into graphite fiber reinforced nano-SiO2 composites. Thermo-oxidative stability of these nano-composites under short-term isothermal exposure was studied. These composites were exposed to isothermal ageing for up to three hours. Dynamic mechanical properties and weight loss measurements indicate that for the composite...
A novel electrowetting on dielectric (EWOD) digital microfluidic device using the high dielectric constant material P(VDF-TrFE) (poly-vinylidene fluoride-trifluoroethylene) as the dielectric layer fabricated by spin-coating process is proposed. The device is featured with the advantages of both IC compatible process and low driving voltage. The contact angle between the liquid droplet and surface...
We demonstrate a compact, ultimate-low-power-consumption, polarization-independent, and high-speed polymer Mach-Zehnder 2times2 photonic switch. Our thermo-optic switch operates with less than 4mW of power consumption via a small-area heater, which is, to our best knowledge, the lowest value of its switch type reported to date. The polarization independent switching crosstalk is less than -25dB while...
It is found that the blending of inorganic materials and organic materials are usually thermodynamically immiscible with each other. The compatibility between the two blending materials can be enhanced by adding a component which is miscible with both parent materials. Therefore, the as-synthesized silicon dioxide grated by L-lactic acid (OLLA-g-SiO2) was used as a compatibilizer to enhance the compatibility...
With the rapid development of economy as well as the rise of packaging industry in China, the polymer packaging products also increases gradually. However, most of these products are one-off products, which mean after being used for once, they are always thrown away. The waste will not only cause serious ldquowhite pollutionrdquo problem, but also leads to a huge waste of resources. This paper analyzed...
A series of Polyimide (PI)-Organically modified clay nanocomposites were made to enhance tensile modulus, thermal stability of rigid PI. PI was made from 3', 4, 4'.-biphenyltetracarboxylic dianhydride (BPDA), p-phenylediamine (PDA). Montmorillonite, one type of layered clay, was treated by n hexadecyltrimethylammonium bromide salt. XRD indicated that OMMT layers were exfoliated and dispersed into...
Demand for high speed, high density, small size, and multifunctional electronic devices has driven the development of 3D integration. Both die-to-die-stack and package-on-package 3D integration are in mass production. However, through silicon via (TSV) 3D integration is the future direction. Materials and processes for TSV 3D interconnection are reviewed in this paper. Those include processes for...
The structural integrity of polymeric interfaces has been critical in enabling microelectronic applications. This paper demonstrates a systematic approach in investigating the strengthening of the polymeric interface between a thinly deposited polysiloxane optical cladding deposited onto flexible substrate. The surface of the polyimide substrate was modified with plasma treatment. Surface properties...
Flexible printed circuit boards (fPCBs) have an important role in electronic product miniaturization due to their reduced thickness and ability to bend and adapt to various shapes. As with any new technology reliability should be assessed to guarantee quality of products that benefit from the additional features. Typical causes of cracking failure in electronic devices are related to mechanical stress,...
This paper focused on design, assembly and reliability assessments of 21 ?? 21 mm2 Cu/Low-K Flip Chip (65 nm technology) with 150 ??m bump pitch. Metal redistribution layer (RDL) and polymer encapsulated dicing lane (PEDL) were applied to the chip wafer to reduce the shear stress on the Cu/low-K layers and also the strain on the solder bumps. The first level interconnects evaluated were Pb-free (97...
Adhesion between epoxy molding compounds (EMCs) and encapsulating mold surfaces is becoming a critical issue for integrated circuit (IC) packaging. Such adhesion results in IC damage or a serious reduction in productivity of the packaging process. It is thus highly desirable to develop mold materials that have excellent releasing properties for EMCs. In this study, the adhesion strengths of various...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.