The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this study, a hybrid multi criteria optimization algorithm involving desirability and Fuzzy coupled with Taguchi methodology is used to evaluate the optimal cutting parameters setting, during finish turning of glass fiber reinforced plastic composite material.
CMOS chips are increasingly used for direct sensing and interfacing with fluidic and biological systems. CMOS circuits for sample acquisition, signal processing, and readout have been integrated with various sensors to form complex biosystems-on-chip. However, distinct and vexing technical challenges arise from the disparate requirements of biosensors and integrated circuits. From the perspective...
Halloysite Clay nanotubes (HNTs) are naturally occurring nanotubes composed of double layered aluminosilicate minerals with a hollow tubular structure in the nanometer range. In recent years, HNTs have attracted specific research attention as a possible new material for various biological applications, including drug and gene delivery vehicles, ultrasound contrast agents, cancer and stem cells isolation...
Interconnect-related problems in the advanced technology node are identified and possible solutions are proposed. A PVD process of a double-layer Ta/TaN barrier is to be replaced with a CVD process of a single-layer barrier. Cu filling process can be changed from PVD seed deposition and electroplating to dynamic PVD reflow of Cu. Manganese and its oxide are shown as a possible choice of new barrier...
This work aims to show the development and results achieved from the application of GPR in different types of surface, such as cement, ceramic, parquet and carpet floor, in order to search for elements or some sort of material evidence that support the hypothesis of the existence of an old elevator in the ‘Casino of Officers’ building. For the quest, was applied a Mala X3M GPR with a frequency of...
Different treatments on the cathode surface are adopted to enhance the secondary electron emission(SEE)of the cathode in high-power continuous wave magnetron tubes, which show that SEE coefficient of the pure tungsten cathode sprayed sand for coarseness and coated W-Re5%wt film is higher than that of untreated pure tungsten cathode.
At the present time getting planar cathodes with good field emission properties and big surface area is one of the most actual tasks in field emission. This goal could be achieved by using carbon-contained powders. In this work are shown the comparative characteristics of carbon powders made by various methods.
In this paper, an experimental investigation of the effects of droplet diameters on the Leidenfrost temperature and its shifts has been carried out. Tests were conducted on a 304 stainless steel polished surface and a stainless steel surface which was processed by a femtosecond laser to form Above Surface Growth (ASG) nano/microstructures. To determine the Leidenfrost temperatures, the droplet lifetime...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
Die to die interconnection in wirebonding process these days is just common in particular to the mature packages using Gold (Au) wire as mean for interconnection. With the intense market competition to deliver a much competitive cost of the products more manufacturers, sub-contractors and even IDM (integrated device manufacturing) are now inclined with the use of Copper (Cu) wire as an alternative...
In implantable medical device applications, quality and reliability are critical aspects of the product. There are some unique mechanical and electrical challenges to the silver filled isotropic electrically conductive adhesive (ECA) used in these devices. The mechanical challenge is the result of the very complicated system design which involves a wide variety of integrated circuits directly bonded...
In this study, we developed single-pitch hybrid bonding technology for high density 3D integration. To realize the single-pitch, smaller than 10-µm pitch, hybrid bonding, 8 µm-pitch Cu/Sn microbumps and nonconductive film (NCF) were used. The planar structure to simultaneously bond was formed by chemical mechanical polishing (CMP). After the planarization, the Cu/Sn bumps and NCF were simultaneously...
This paper presents novel functional surface designed for collecting water vapor, which is combined of PDMS and the micro level hydrophilic metal alloy ball. To imitate biological structure, the metallic balls are designed as hydrophilic part and PDMS substrate as hydrophobic structure. The ball is used as nucleation centers to absorb water vapor in the air to form droplet. Then, with the drop gradually...
Self-assembly approaches to construct plasmonic materials often result in high-symmetry structures within a thermodynamic limit. Here we demonstrate a novel selective self-assembly route for synthesis of a new class of nanoplasmonic structures with symmetry-breaking.
Precisely controlled blind via-holes were formed in multilayer substrates by an ultrafast laser. A LIBS detector integrated into the laser processing machine realizes the full potential of the ultrafast laser.
We develop composite solid-state lasers and nonlinear wavelength-conversion devices by room-temperature bonding. The room-temperature-bonding technique has a potential of realizing new high-power and highly efficient laser devices over a wide wavelength range.
With accelerating progress in the field of machining, use of newer and harder materials like titanium, stainless steel, high-strength temperature-resistant (HSTR) alloys and ceramics has become common and has resulted in a number of available Non-traditional machining (NTM) processes. With increased number of available options, the need arises to select the most efficient NTM process for machining...
The objective of this research is to investigate the comparison nanosilica and aluminium powder in epoxy as adhesive on shear strength of single lap joint between aluminium-GFRP composite. The shear strength was determined by utilizing the single-lap shear test. The nanosilica content was varied in 0, 1, 2, 3 and 4 (w/w), whereas the content of aluminium powder was varied in 15, 20, 25, 30 and 35...
In precision machining, machining efficiency is improved by high-feed, high-rotation milling using small-diameter ball end milling. Additionally, static air bearings having excellent properties including low friction, low vibration, high accuracy, and rapid response have been used widely to maintain cutting speed. However, insufficient investigations have been conducted of the stabilization of rotational...
Wear processes of the switching contact pair consisting of a gold layer on multiwall carbon nanotubes (Au/MWCNT) and a chromium and gold coated hemispherical ball (Au/Cr) are evaluated over a range of current conditions. The switching experiments were conducted using typical conditions for a MEMS relay application, i.e. 4 V, with static contact force 1 mN with currents level of 20 - 200mA. The Au...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.