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Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper...
Die to die interconnection in wirebonding process these days is just common in particular to the mature packages using Gold (Au) wire as mean for interconnection. With the intense market competition to deliver a much competitive cost of the products more manufacturers, sub-contractors and even IDM (integrated device manufacturing) are now inclined with the use of Copper (Cu) wire as an alternative...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
To meet the requirements for future fine pitch and high-performance interconnects in advanced packaging, ICAs with nano-materials are attracting more and more interest due to their specific electrical, mechanical and optical properties. There has been extensive research on nano-conductive adhesives containing nanofillers such as nanoparticles, nanowires or carbon nanotubes. In this paper, copper nanoparticles...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
In this presentation the development of an induction motor of which stator core is made of molded SMC (Soft Magnetic Composite) will be presented. The molded core shows low iron loss compared to the iron loss of machined core. Iron loss of machined core is large because of the heat at the machining of bulk SMC. Moreover, by using SMC, 3D shaped core is easily constructed. The teeth of the stator core...
This paper introduces a process used to produce stable and reliable Cu-Al joints with a high degree of freedom regarding component geometries. The process uses the accurate controllable energy input of the beam processes (electron- or laser beam) and the difference of the fusion temperature of the two materials. The paper shows the problems and the state of the art of joining copper and aluminium;...
This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits...
Physically larger more complex server processors are creating or exacerbating thermal and mechanical challenges in platform design. The larger processors are due, in large part, to the ever increasing core count, increasing integration, and growing I/O performance requirements which pushes pin count demand upwards on the socket thus driving higher processor loading requirements. As a direct result...
This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material...
The following study is motivated by the need to capture the elasto-viscoplastic behavior of a “real” industrial power module lead-free solder joint. In this work, we carried out a numerical design of experiments in order to forecast the ability of an experimental bending system to identify the specimen material properties. As a proof of principle, the micro-mechanical elastic behavior of power module...
Today's state-of-the-art top level interconnect technology in power modules is an aluminum wire wedge/wedge bond process. Being the bottleneck for realizing even higher switching frequencies and thus higher junction temperatures made possible by upcoming wide bandgap semiconductors, innovative packaging technologies such as copper wire wedge/wedge bonding are a key issue in pushing the technological...
Printed circuit board (PCB) design and manufacturing has traditionally used heavy copper layers within the board as a method of dissipating heat loads from high performance, high heat-generating devices mounted on the boards. These copper layers add substantial weight, have a very high coefficient of thermal expansion (CTE) in relation to other board fabrication materials and the semiconductor devices...
The technology of Radio Frequency Identification is becoming widely used in industry engineering. However, the UHF RFID tag can be easily affected by environmental noise factors, especially on the metal surface. The metal effect to Radio Frequency Identification (RFID) location system is described in this paper. Different methods are adopted to analyze the circumstances when RFID location system is...
Pulsed laser ablation in liquids is a simple synthesis process of nano-particles for the production of high purity material with no need for any expensive instrumentation except laser. The 532 nm wavelength laser beam with 5 ns pulse width and 10 Hz repetition rate was an ablating laser source. In order to control the size and stoichiometry of the nano particles, the laser ablation was done in the...
Ultrasonic welding is one of the mainstream joining technologies for an automotive battery pack where battery cells are welded mostly in series with bus-bars on interconnect circuit boards in battery electric vehicles (BEV). Mathematical simulations, such as Finite Element Analysis, have been used to simulate the ultrasonic welding for process and joint quality optimizations. Since friction-generated...
This paper discusses measurement of temperature on busbar connection based on contact resistance and plating material in relation to the value of contact resistance. This study is intended to prevent failure when busbar connection is attached. The failure of the electrical connection can occur due to bad contact so that the contact resistance is increased, high losses, overheating, and it can even...
Piezoelectric cantilevers have found a wide usage in sensor technologies for mass sensing and energy harvesting. This paper reports theoretical calculations, Finite Element Method (FEM) simulation and experimental measurements of mass detection using piezoelectric bimorph cantilever (PZT-5H) in macro (mm) scale. The dimensions of the cantilever are 33mm, 10mm, and 0.5mm for length, width, and thickness,...
Electrical grounding systems are heavily dependent upon copper. Due to its scrap metal value copper is an attractive target for thieves and vandals. Copper theft presents one of the biggest threats to electrical safety systems and results in escalating costs, operational downtime and threats to life and assets. This is the case for transmission lines, because their isolated location and the unattended...
3D integration technologies show increasing importance for high volume applications while realizing the smallest system dimensions at least. Therefore vertical interconnect and wafer bonding technologies were optimized and adapted to reach a high yield using quite narrow contact areas and bond frames. These technologies must enable mechanical stable bonding with high degree of strength, hermeticity,...
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