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The dependence of the strain around solder joint on underfill material properties was studied using three different materials by both of the simulation and the experimental measurement. The internal strain of the underfill during the temperature cycle which is −55 to 125°C was monitored. The temperature cycle test up to 1000 times was also implemented with the daisy chain open / short test of the...
The aim of the study is to carrying out a series of experimental reliability tests for lead solder alloy Sn63Pb37 regarding to the so-called model of damage accumulation. In spite of Sn63Pb37 is prohibited in mostly cases by RoHS directive it is still used in lots of electronic devices which have influence on human life safety e.g. life-support machines, airplanes etc. That's why authors decided to...
The board level reliability of BGA multichip modules was characterized under thermal shock and drop test conditions. The variables studied were BGA pattern, substrate surface finish, solder joint size, and module size. Thermal cycle reliability was quite robust for all test vehicles since the body sizes were less than 7mm on a side. Drop test reliability improved with smaller body size, larger solder...
Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths....
QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely used for QFN packages in handheld devices, some customers require it for heavy industrial application demanding thicker PCB. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power...
Electronic components, such as ball grid array (BGA), chip scale packages (CSP) and bottom terminated components (BTC) used in harsh use environments often require the use of conformal coatings to meet reliability requirements. In certain coating application methods, the conformal coating materials can flow underneath the component and cause solder joint failure during thermal expansion and contraction...
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to...
RDL first FOWLP with the advantages reducing die shift and wafer level warpage during the fabrication process has been developed. The drop impact reliability for the large size (20 mm×20 mm) RDL first FOWLP is one major concern for the mobile applications. Under drop test loading, crack and delamination failures may happen to the dielectrics layer and solder joints. In this paper, reliability of 20...
With long-life-time of LED lamps, it takes long time to get feedback from field about failure information. We need develop test method, and adopt them in manufacture process to make "early detection" of the failures caused by the variations in component and production process. This paper describe some dominant failures modes we found in market, and some typical tests method used in the manufacturer...
For several years, an approach to use fine-pitch flip chip package (<150um) with copper pillar/ microbump is for the realization of 2.5D/3D packages of higher density and performance enhancement. Generally, flux is widely used to clean the surfaces to be soldered for good wetting and form reliable joints. The upcoming concerns about fluxes are clean-ability for fine-pitch package, voiding and compatibility...
Rising with consumer electronics, mobile and wearable devices electronic packaging is developed with high power, high I/O, small size and good reliability performance. Among the various packages adopted by industry, Wafer Level Chip Size Packaging (WLCSP) and Ball Grid Array (BGA) possess characteristics mentioned above and therefore widely used in various kinds of devices. However, concerning different...
With the decrease in the overall size and the rapid increase in the working frequencies of printed circuit boards, the reliability of solder joints, especially the high frequency signal transmission reliability has become the key factor in system reliability. In this paper, changes in RF impedance of solder joints in a temperature cycling environment was studied using time-domain reflectometry measurements...
The reliability of board-level solder joint that provides the mechanical and electrical connections between the chip and print circuit board is such an import issue that they can result in the failure of the whole equipment under real service condition. The multiple stresses in service environment such as temperature and vibration loadings can cause the fatigue failure of solder joints easily. In...
The demand for reliable wafer level chip scale packages (WLCSPs) is getting higher due to the need for higher performance and smaller form factor designs. Small WLCSPs have been used with good board-level reliability but larger WLCSPs have not. In the study, a high Tg, low CTE reworkable edgebond adhesive is proposed to enhance the board-level solder joint reliability of a large WLCSP having a chip...
Wafer Level Chip Scale Package (WLCSP) has been widely used in MEMS and SiP packages; application of mobile and consuming products. It advantages in lightweight, reducing manufacturing cost, low I/O density and high performance because the bumps directly interconnect between die and motherboard. However, the lower Temperature Cycling on Board (TCoB) reliability performances because of CTE mismatches...
The electromigration (EM) performance of pristine and ZrO2 doped Sn58Bi solder was studied using line-type structure, in order to reduce current crowding at the solder/pad interface. Cu/solder/Cu interconnects were applied with a direct current of 2.5 A, which generated a current density of 7.96×103 A/cm2, and stored in an oven at a temperature of 70 °C. After 300 hours current stressing, samples...
Fe-Ni film with compositions of 45wt.% Ni, which is also denoted as Fe-45Ni, was used as under bump metallization (UBM) to evaluate the interfacial reliability of SnAgCu/Fe-Ni solder joint under electromigration (EM) test. For comparison, commercial Cu UBM was also adopted in the reliability test. The microstructural evolutions of these two UBM solder joints were observed by scanning electron microscope...
Soldering of packaged electronic components using industry standard Sn-Ag-Cu (SAC) lead-free solders on low-cost foils, which are often the substrate of choice for flexible electronics, is challenging. This is mainly originating from the fact that the reflow temperatures of these solder alloys are normally higher than the maximum processing temperature of the low-cost flex foils. To enable component...
In high reliability Surface Mount Technology (SMT) assembly applications, the ability to inspect the solder joints visually has been standard and has been key factors in providing confidence in solder joint reliability. Inspection techniques such as X-ray can be used to detect gross manufacturing defects such as solder bridging, but are not suitable for detection of other defects such as cracks. Temperature...
In high reliability Surface Mount Technology (SMT) assembly applications, the ability to inspect the solder joints visually has been standard and has been key factors in providing confidence in solder joint reliability. Inspection techniques such as X-ray can be used to detect gross manufacturing defects such as solder bridging, but are not suitable for detection of other defects such as cracks. Temperature...
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