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Wafer-level chip-scale package (WLCSP) with solder joint as interconnection process was used to enable, thinner, low cost and fine-pitch for mobile type of information and communication device that assembly into SiP module. However, the lower solder joint reliability performances is the key challenge and more and more serious as increasing WLCSP package size, especially the size is larger than 6mm...
Wafer Level Chip Scale Package (WLCSP) has been widely used in MEMS and SiP packages; application of mobile and consuming products. It advantages in lightweight, reducing manufacturing cost, low I/O density and high performance because the bumps directly interconnect between die and motherboard. However, the lower Temperature Cycling on Board (TCoB) reliability performances because of CTE mismatches...
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