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Super short channel control (sub-threshold swing = 95 mV/dec) in Ge n-type Fin Field-Effect Transistors (n-FinFETs) is achieved through the promising gate stack characteristics of gate leakage (Jg)-equivalent-oxide-thickness (EOT) and ultra-high k-value (∼312) with the implement of the magnetic gate stack scheme. On the other hand, the negative capacitance effect is also observed in the magnetic Ge...
In order to estimate and to describe the actual fatigue lifetime of advanced packaging, utilizing the methodology of accelerated thermal cycling (ATC) experiment is an essential procedure to hasten the fatigue growth time through the manner of placing concerned vehicle in a severe condition as compared with the real working environment. Behind ATC tests, the experimental results and acceleration factor...
Rising with consumer electronics, mobile and wearable devices electronic packaging is developed with high power, high I/O, small size and good reliability performance. Among the various packages adopted by industry, Wafer Level Chip Size Packaging (WLCSP) and Ball Grid Array (BGA) possess characteristics mentioned above and therefore widely used in various kinds of devices. However, concerning different...
The accelerated thermal cycling test is a standard method which is currently used to characterize the reliability performance of electronic packaging. The test vehicles are placed in a condition which is harsher than the actual usage condition in order to reduce the testing and development time. Recently, in order to further reduce the testing time, the ramping rate of thermal cycling test is increased,...
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