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Electronic components, such as ball grid array (BGA), chip scale packages (CSP) and bottom terminated components (BTC) used in harsh use environments often require the use of conformal coatings to meet reliability requirements. In certain coating application methods, the conformal coating materials can flow underneath the component and cause solder joint failure during thermal expansion and contraction...
A Physics of Failure (PoF) Reliability Assessment combines dynamic stress analysis of usage and environmental conditions with failure mechanism models to perform a durability simulation in order to identify failure susceptibilities and calculate reliability behavior over time. CAE Apps have been developed that automate PoF analysis tasks that allow non-CAE experts to perform expert level PoF evaluations...
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