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Design Hotspots are features on a silicon chip, which are susceptible to pattern failures. While multiple methods like DRC, ORC and CFM inspection are used to identify these Hotspots, in-line monitoring of these design Hotspots has remained a challenge. Existing methods of Hotspot inspection, which include API and EBI are not suited for large scale inspection due to system limitations and throughput...
In this work, the electrochemical etch stop for reverse biases up to 25V at abrupt pn-junctions on 200mm silicon wafers with four and three electrode configuration is investigated. It was found that for such bias conditions across the pn-junction the etch results differ significantly from the prediction of an established model for the electrochemical etch stop under open circuit potential conditions...
Layered Queueing networks are a common method for solving performance models of modern distributed computer systems that use blocking remote procedure calls. Several analytic methods exist to solve these networks, many of which use the method of decomposition to break the model up into smaller, more easily solved submodels. Analytic solutions that break up a model must take into consideration interlocking,...
Knowledge and control of local stress development in BEoL stacks and nearby TSVs in advanced 3D integrated devices is a key to their thermo-mechanical reliability. The paper presents a combined simulation / measurement approach to evaluate stresses generated in the result of the TSV and BEoL stack manufacturing and 3D bonding processes. Stress measurement methods of high spatial resolution capability...
This paper present the results of mathematical modeling of induction hardening processes applied to workpieces with complex geometries. The simulation of heating and quenching problems is organized by coupled multi-physical analysis of electromagnetic, thermal and optionally structural processes. Different models and the developed strategy for their use for designing the induction systems are demonstrated...
Service provenance can be defined as a profile of service execution history. Queries of service provenance data can answer questions such as when and by whom a server is invoked? which services operate on this data? What might be the root cause for the service failure? Most of the organizations today collect and manage their own service provenance in order to trace service execution failures, locate...
The rate of particle induced soft errors in a processor increases in proportion to the number of bits. This soft error rate (SER) can limit the performance of a system by placing an effective limit on the number of cores, nodes or clusters. The vulnerability of bits in a processor to soft errors can be represented by their architectural vulnerability factor (AVF), defined as the probability that a...
A physics-based, charge-based model for P-type Gaussian doped DG MOSFET is presented in this work. The developed model is also applicable to the investigation of the impact of channel material on the performance of p-type DG MOSFET. The reliability issues of the p-type MOSFET have also been demonstrated using both developed analytical model and simulated results. The performance degradation due to...
Service composition is an important means for integrating the individual Web services for creating new value added systems. However, Web service runs in the heterogeneous environments on the Internet, it is difficult to guarantee the reliability of service composition. To address this problem, we propose a systematic method to model and analyze reliability for service composition. First, we present...
Micro blogging is fast becoming a dominant medium in social media and its impact is evident in our daily lives. A massive amount of information is produced on a daily basis. It is observed that detecting hot topics can be very helpful for people to get essential information quickly. But due to short and sparse features, high flood of meaningless tweets and other characteristics of micro blogs, traditional...
Recently, significant work has been carried out to develop a technology based on 4H-SiC semiconductors aimed to utilize the unique physical and electrical properties of this material to achieve improved performance in high-power and high-temperature electronic circuits. This work is an effort to develop an analytical model for the 4H-SiC based n-channel enhancement mode MOSFET (NMOS). Here, a simple...
As signal speeds continue to increase, maintaining signal quality has become a greater challenge for signal integrity (SI) engineers. Migrating a system to a next-generation interface technology operating at higher speeds brings with it increased sensitivity to attenuation and jitter that can severely curtail reach and reliability. In order to meet the interface specification, expensive choices such...
Studies of multi-server networks are usually conducted on the assumptions of independent servers and specific arrivals, which may not capture the characteristics of realistic networks. In this paper, we propose a novel stochastic network calculus approach to perform delay analysis for a general multi-server network. The stochastic network service curves are derived in two ways with different assumptions...
The concept of integration of transistors evolves towards smaller line widths. This can be achieved by the prominent Very Large Scale Integration (VLSI) technology. The level of integration of silicon technology as measured in terms of number of devices per IC. This leads to the idea of scaling in MOSFET (Metal Oxide Semiconductor Field Effect Transistor) devices. Scaling enhances the design or manufacturing...
With the rapid development of simulation science, knowledge reuse in this domain becomes a challenge. This paper concentrates on the system design of a simulation knowledge base management system. Furthermore, a semantic matching algorithm based on ontology has also been proposed for simulation knowledge retrieval.
Mechanical stress induced by mechanical and thermal loading on thin silicon devices breaks the devices at a certain load called the fracture or breaking strength of the device. The displacement experienced by the dies, due to bending, at fracture strength is called the fracture displacement. The strength properties of thin, bare silicon dies have already been reported. This work extends the study...
The multichip packaging techniques have evolved over the years and have resulted in many solutions towards 3D integrated circuits. The key component to these technologies is Through Silicon Via. Typical TSV structures (2.5 micron diameter and 20 micron length and 5 micron diameter and 50 micron length) are analyzed using HFSS, with a view to generate data and understanding of TSV performance, specific...
We propose an analytical, time-domain model for microring modulators, which encompasses pn-junction and resonator dynamics. It shows excellent agreement with experiment for high frequency operation beyond 20 GHz. Pulse-amplitude modulation is predicted for up to 80 Gb/s.
We present analytical on-state drain current model of 2-dimensional (2D) planar-type poly-Silicon TFT devices. The effect of grain and grain boundary on the carrier transport of 2D poly-Silicon devices has been studied by simulation (matlab) tool. Especially, we considered physical parameters such as grain length (Lg), grain boundary length (Lgb) and grain boundary trap density (NGB) in order to analyze...
Service Supply Chain (SSC) have seen considerable attention in the business circles and academia. However, little focused on Service Integrator (SI), especially the research results about SI competitiveness and its influencing factors in the context of SSC has not yet appeared. This paper study the formation mechanism of Service Integrator competitiveness (SIC) under the perspective of SSC and its...
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