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A hybrid switch configured by silicon insulated gate bipolar transistor (Si IGBT) and silicon carbide metal-oxide semiconductor field effect transistor (SiC MOSFET) have been investigated to be a cost effectiveness and high efficiency. In this paper, we aimed reducing the hybrid switch loss and expanding operation area of frequency and current. We measured dependency on various parameters to analyze...
The properties of SiC Power Mosfet transistors have been known for years and have been extensively described in the literature. Also, new generations of SiC transistors and diodes are being developed. Power Mosfet transistors are mainly used in power electronics applications in which such transistors operate as controlled switches. In this case, equipment design engineers focus their attention on...
Power semiconductor devices made with wide-bandgap (WBG) materials such as Silicon Carbide (SiC) are improving the energy conversion efficiency, power density, and switching performance of converters. This paper presents a comparative performance evaluation of Si IGBT, SiC JFET, and SiC MOSFET power devices implemented in an otherwise identical, non-isolated dc-dc boost converter. Switching characteristics...
An analysis of the failure modes due to short circuit on planar and trench 1200ν — 40mΩ SiC-MOSFETs is presented, including single and multiple events. Short circuit waveforms, energy, as well as electro-thermal simulations are presented, enabling the identification of the main root causes of failure. Results demonstrate similar performance regarding failure after turn-off (thermal runaway, gate)...
In recent years, the advent of Metal Oxide Semiconductor Field Effect Transistor (MOSFETs) rank as one of the most significant development in power electronics. Its ability to work at high-voltage and high-frequency make MOSFETs become the most important electronic device for many power system circuit. For harsh environment application in example the satellite system, requires the MOSFETs dealing...
In this paper, we explain the THz detection mechanism in sub-threshold Si MOSFETs by exploiting the exponential dependence of channel electron density to the gate-source voltage. According to our theory, this high frequency non-linear dependence is the underlying mechanism for rectification of THz radiation. The maximum detection frequency is limited by dielectric relaxation time of the electrons...
A 3-Dimensional (3D) strained Silicon Nanowire MOSFET simulation and inversion charge model are presented. The simulation studies are conducted based on electrical parameters of nanowires such as current and threshold voltage using a ATLAS TCAD simulator. The inversion charge model with Germanium fraction is formulated using a unified charge model. These characterization studies are performed to investigate...
At present, the SiC devices have been widely concerned with the excellent characteristics of low switching losses, which can significantly improve the frequency of power electronic converters, and also have broad application prospects in the field of rail transportation. In this paper, through the establishment of 1500V powered subway auxiliary inverter loss model, the author estimated loss and efficiency...
In this paper, a 400kHz high-frequency dual-buck inverter is fabricated for the applications of small scale renewable energy generation. A systematic calculation method for the converter's loss distribution is proposed to evaluate the efficiency. This method concerns the impacts caused by the high frequency on the loss distribution, which are always neglected by the traditional method. In the last,...
This paper is mainly focus on bidirectional on-board charger with high performance and low cost. With SiC MOSFET, it is possible to make the on-board charger high efficiency, high power density and light weight. However, the price of the SiC MOSFET is higher than Si based MOSFET. Therefore, a high performance on-board charger with a small number of SiC MOSFET is the key factor to limit the cost of...
Reliability of Superjunction (SJ) MOSFET is closely related to its manufacturing process. Experiments are carried out to investigate the electrical characteristics in high temperature of SJ MOSFET produced by deep trench filling technology. Filling holes are confirmed to be responsible for the performance deterioration in high temperature and the mechanism has been analyzed thoroughly.
We perform experimentally validated statistical device simulation to explore characteristic fluctuation induced by random discrete dopants (RDDs) inside the source / drain extensions of undoped gate-all-around silicon nanowire MOSFETs. The engineering findings of this study indicate that both the DC and dynamic characteristic fluctuation caused by RDDs of the drain extension has relatively smaller...
We present the results of Single Event Effects (SEE) testing with high energy protons and with low and high energy heavy ions for electrical components considered for Low Earth Orbit (LEO) and for deep space applications.
Silicon photonic interconnects are being considered for integration in future networks-on-chip (NoCs) as they can enable higher bandwidth and lower latency data transfers at the speed of light. Such photonic interconnects consist of photonic waveguides with dense-wavelength-division-multiplexing (DWDM) for signal traversal and microring resonators (MRs) for signal modulation and detection. To enable...
The unprecedented technological success of the electronics industry over the last five decades have been driven by Silicon (Si) technology at the center of which resides the metal oxide semiconductor field effect transistor (MOSFET). Relentless scaling of MOSFET dimensions ensured faster and cheaper computing since more and more transistor could be packed into the same chip area.1 At the same time...
In this paper, we demonstrate for the first time an implant free In0.53Ga0.47As n-MOSFET that meets the reliability target for advanced technology nodes with a max operating Vov of 0.6 V. In addition, an excellent electron mobility (μeff, peak=3531 cm2/V-s), low SSlin=71 mV/dec and an EOT of 1.15 nm were obtained. We also report the scaling potential of this stack to 1nm EOT without loss of performance,...
We present vertical InAs nanowire MOSFETs on Si with an In0.7Ga0.3As drain. The devices show Ion and gm/SS record performance for vertical MOSFETs and Ioff below 1 nA/μm at Vd 0.5 V. We show a device with gm=1.4 mS/μm and SS=85 mV/dec, therefore having Q-value (gm/SS) of 16. The device has Ion=330 μA/μm and 46 μA/μm at Ioff 100 nA/μm and 1 nA/μm, respectively. Furthermore, we show a device with SS=68...
Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) have the potential to increase the power density in power electronics converters compared to the currently used silicon (Si). Their benefits are higher efficiency, higher switching speeds, and higher operating temperatures. Moreover, SiC MOSFETs, which are normally-off, offer the possibility to directly replace Si Isolated-Gate-Bipolar-Transistors...
We report high performance extremely-thin-body (ETB) Ge-on-Insulator (GOI) pMOSFETs fabricated by a new Ge condensation process with minimized temperature cycles and slow cooling-down rate. This new condensation process effectively suppresses strain relaxation during Ge condensation and creates high compressive strain. By combining the highly-strained GOI substrates with a digital etching process,...
As a transparent conducting oxide with a large bandgap of ∼4.9 eV and associated large estimated critical electric field (Ec) strength of 8 MV/cm, β-Ga2O3 (BGO) has been touted for its tremendous potential as a power switch. Power switch metrics such as Baliga's figure of merit (BFOM) estimating dc conduction losses and Huang's material figure of merit (HMFOM) incorporating dynamic switching losses...
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