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Silicon Carbide (SiC) power devices with super-cascode structure provide a cost-effective solution for high performance medium voltage power switches. However, these SiC super-cascode devices are still in the early development stage, and limited information on the device characteristics is available. This paper presents the characterization and evaluation of a 4.5 kV, 40 A SiC super-cascode device...
Following the recent advances in the production of 3.3 kV and 10 kV SiC power MOSFETs, Wolfspeed launched an effort to develop a new generation 6.5 kV SiC power MOSFET to fill the medium-to high-voltage fast switching device void in applications such as rail traction and mediumvoltage motor drives. The characteristics of the new generation 6.5 kV SiC power MOSFET rated at a drain current of 30 A,...
Based on the parabolic potential approach (PPA) and equivalent number of gates (ENG), a new quasi-3-D subthreshold current/swing model for the fully depleted quadruple-Gate (FDQG) MOSFET is developed. The model explicitly shows how the channel length, gate oxide thickness, and silicon film thickness affect the subthreshold current/swing behavior. The model is verified by its calculated results matching...
Due to its potential applications in optoelectric area, WS2/graphene heterojunction attracts much attention in past years. But until now, modulation of their working performance is still a big challenge for the researchers. In this work, WS2/graphene heterojunctions have been sucessfully fabricated on Si substrate. Moreover, their surface configuration were researched by STM and AFM techniques. Finally,...
The superior electrical and thermal properties of silicon carbide (SiC), when compared to silicon (Si), has lead to it being used in power converter designs that require high efficiency and low volume. However while choosing the semi-conductor material for these high performance designs is relatively simple, the specific type of SiC device (e.g. JFET, MOSFET or BJT) is not so straight-forward. This...
Power switch devices which base on wide band-gap (WBG) semiconductor, such as silicon carbide metal-oxide-semiconductor-field-effect-transistor (SiC MOSFET) and gallium nitride high-electron-mobility transistor (GaN-HEMT) perform superior performance as compared with silicon (Si) MOSFET in high switching frequency, high blocking voltage, and high temperature operation. In this paper, a series of characteristic...
Gallium Nitride (GaN) based devices on Silicon (Si) substrates (GaN-on-Si) promise unmatched performance at low cost. Despite this theoretical promise, the lattice and thermal conductivity mismatch between the GaN and Si has obstructed the realization of reliable electrically graded high voltage devices. Recently, a small number of manufacturers have claimed the successful development of such devices...
Wide-bandgap (WBG) devices are believed as the alternate of silicon switches for high-efficiency and high-power-density power electronics converters. While two major challenges of WBG devices remain as high cost (∼5 times of Si) and less options (the maximum power rating for GaN is only 650V/60A), paralleling GaN with Si could be the potential solution to solve pains above. In this paper, two SMT...
Gallium Nitride (GaN) semiconductors have extremely low switching loss, high breakdown voltage, and high junction temperature rating. These characteristics enable improved device performance and thus improved switch mode power converter designs. This paper evaluates the Pareto-optimal performance improvements for a DC generation system with predicted GaN loss characteristics and a rigorous multi-objective...
In this paper, key aspects of silicon-carbide (SiC)-based automotive traction drives are reviewed. Firstly, the required supporting factors to achieve optimal operating conditions and best performance are described. Major component sizing methodologies and constraints are included. Expectations on gate threshold voltage, trans-conductance, and transient oscillation are discussed. Tolerance against...
The U.S. Army Research Laboratory (ARL) and Wolfspeed developed silicon carbide (SiC) vertical MOSFETs for linear-mode operation. The motivation is to determine whether SiC's material properties enable SiC MOSFETs to withstand higher pulse-current density and energy dissipation than is achievable with commercial silicon linear-mode MOSFETs. The SiC device is a 3.3 mm × 3.3 mm chip with a thick gate...
This paper presents a new CMOS stress sensor readout method based on the ratiometric measurement principle. A unique feature of this method is to simultaneously detect the in-plane stress magnitude and angle. The sensor core is a cascoded current mirror structure consisting of a reference input branch and four output branches with MOSFETs in 0°, 45°, 90° and 135° layout orientations. Current ratios...
In this work, we provide early insight into the combined tradespace for both power switching and RF applications afforded by the high critical, electric-field strength of β-Ga2O3. MOSFETs formed by homoepitaxial growth of β-Ga2O3 films doped with Sn, Si, and Ge on bulk substrates have been characterized electrically. Several key milestones have been achieved such as enhancement-mode operation >...
CMOS and tunneling FETs (TFETs) utilizing low effective mass III-V/Ge channels on Si substrates is expected to be one of the promising device options for low power integrated systems, because of the enhanced carrier transport and tunneling properties. In this paper, we present viable device and process technologies of Ge/III-V MOSFETs and TFETs on the Si CMOS platform. Heterogeneous integration to...
Terahertz technology has grown much interest especially in the imaging field. This development, compliant with the low-cost sub-micron CMOS process for focal plan array configuration, addresses some issues about the performances of antennas on a silicon substrate and on a reduced metal stack. Here, two antenna geometries are studied on different electromagnetic (EM) environments and coupling characteristics...
In this paper, a compact model for the gate current in HKMG nMOS transistors is presented. The carrier transport through the multi-stack gate dielectrics of HKMG MOS transistors is shown to be dominated by the Trap Assisted Tunneling and Poole-Frenkel conduction mechanisms. Both these mechanisms occur simultaneously and each is dominant in a particular gate voltage range. The interdependence and simultaneity...
Silicon Carbide (SiC) diodes are already commercially available since 15 years and have gained significant market share in power supply and solar converter applications. In the last few years, the SiC device family was enriched by switches. They become increasingly more important for differentiation of power converters in size, weight and/or efficiency. The dedicated material properties of SiC enable...
Single and multi-voids position effects will be highlighted from an electrothermal viewpoint. Complementary numerical investigations will show that these effects are strongly dependent on the properties of the backside metallization of the MOSFET chip. The methodology based on a coupled analysis of electrothermal modeling and experiments that led to these conclusions will be detailed.
The effect of humidity on SiC Power MOSFET modules is investigated in an industrial application. Four modules are operated outdoor and four modules are operated indoor in identical setups, while their breakdown voltages are monitored regularly. The evolution of the leakage current, indicating humidity-induced degradation is observed.
This work discusses the challenges in the design of a SiC Power MOSFET compared to their silicon-based relatives and describes a novel SiC Trench MOSFET concept. The most prominent difficulties being identified are related to the properties of the channel and the gate dielectric as well as their interface. Different approaches to realize a SiC MOSFET are briefly discussed and the CoolSiC™ MOSFET concept...
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