Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
A local bending stress is induced by coefficient of thermal expansion (CTE) mismatch between underfill material and metal microbumps in three-dimensional IC (3D IC). A high concentration of filler in underfill is effective to suppress the local bending stress. However, it is difficult to apply high concentration of filler due to fine pitch microbumps. On the other hand, manganese nitride-based compound...
WLCSP has been widely adopted for package solution of the portable and wearable electronics products by its advantages of very low package cost and good electrical performance. Knowing WLCSP provide almost no protection to silicon IC chip, its quality and reliability performance becomes critical for successful product application. A 28nm TV with extreme Low-k inter-metal-dielectic material (ELK IMD)...
One of the major challenge with CMOS circuits with 22nm technology & beyond is to buried the issues of increasing in power dissipation of the circuits due to higher order effects & leakage current. The traditional transistor or MOSFET require significant amount of power so the circuit present on the chip will require a large amount of power due to presence of many transistors in the circuit...
As IC technologies continue scaling down, traditional electrostatic discharge (ESD) devices can no longer meet the demands of modern protection, prompting the need for novel device structures. A novel and unique approach to ESD protection using suspended graphene ribbon devices is presented. It has been demonstrated the ribbon's electro-mechanical response to a sudden surge of charge, such as an ESD...
Alpha emission rate measurements were performed on solder bump material at room temperature and post bake at high temperature. Results indicate an increase in alpha emission rate after high temperature bake process attributable to Po-210 out-diffusion from such solder bumps. Real-time system-level soft error rate (SER) measurements show >60% higher SER/bit when the tests are conducted at elevated...
Due to the prohibitive costs of semiconductor manufacturing, most system-on-chip (SoC) design companies outsource their production to offshore foundries. An untrusted foundry can manufacture and sell additional unauthorized chips for profit in violation of their contract. This overproduction can not only cause significant loss of revenue to the designer, but may also have national security implications...
In this paper, we consider a wireless network with one full-duplex (FD) base station (BS) and a set of half-duplex (HD) user equipments (UEs). In such scenario, in addition to the self-interference, the co-channel interference from uplink UEs to downlink UEs is the main bottleneck for the network performance. To overcome this, we consider the problem of maximizing the minimum fairness rate among all...
Digital fingerprinting refers to as method that can assign each copy of an intellectual property (IP) a distinct fingerprint. It was introduced for the purpose of protecting legal and honest IP users. The unique fingerprint can be used to identify the IP or a chip that contains the IP. However, existing fingerprinting techniques are not practical due to expensive cost of creating fingerprints and...
A novel single-phase single-stage transformerless grid-connected current source inverter is proposed for photovoltaic system application. The proposed inverter consists of one inductor, four unidirectional switches and two diodes. The proposed inverter does not suffer from ground leakage current since that the PV panel and the gird utilize common ground. Also, the proposed inverter is capable of connecting...
This paper describes a cold-cathode nanoelectronic device that is compact, self-aligned to the vacuum cavity and cost-effective, as manufactured through standard silicon fabrication integrated circuit (IC) processes. Measurements on a first prototyped array of 5×4 diode-connected parallel devices with silicon area of 5um×4um, confirm Fowler-Nordheim emission with turn-on voltage as low as 2 V, while...
The first high voltage Gallium Nitride (GaN) switches to appear in the market were based on depletion-mode HEMT (dMode FET) technology. This requires either a complex gate driver to manage the negative threshold or a low voltage FET in cascode configuration. The lack of direct control of the GaN switch and the need for expensive multichip packaging has delayed the adoption of GaN power stage in off-line...
In this paper, heat transfer in 3D IC system is investigated using practical and novel materials for Inter Layer Dielectric (ILD) and Thermal Through Silicon Vias (TTSV). The currently used SiO2 ILD is amiss for heat mitigation due to its poor thermal conductivity. The unique thermal and electrical properties of Hexagonal Boron Nitride (h-BN) are explored in this work for improved heat mitigation.
In order to solve the problem that special audio chip cannot rewrite Speech content online, a low-cost technological scheme is proposed in this paper. It adopts Pulse Width Modulation (PWM) technology and microcontrollers with PWM peripherals to turn WAV file date into Pulse Width Modulation wave and to recover analog speech signal through low-pass filter. By using the RS485 bus to rewrite WAV file...
Hybrid systems combine Large-Area Electronics (LAE) with high-performance technologies (e.g., silicon CMOS) [1]. With architectural concepts for hybrid systems broadening to match the range of emerging applications, this paper examines modular approaches for multi-sheet, multi-technology integration. It identifies the interfaces required as a critical backbone. For interfaces associated with various...
This paper addresses the problem of counterfeiting of medicines in the form of pills and capsules by proposing a novel micron-scale secure RFID tag that would be inserted into the pill or capsule during the manufacturing process. For secure identification and authentication, a tagged pill or capsule would be scanned by a small inexpensive RFID reader, and key medicine information such as the drug...
We present an architecture for self-motivated agents to organize their behaviors according to possibilities of interactions proposed by the environment, and to modify the environment to construct new possibilities of interactions. The long-term goal is to design agents that construct their own knowledge of objects through experience, rather than exploiting pre-coded knowledge, and exploit this knowledge...
This paper investigates the use of asymmetric through-only de-embedding approach for on-chip stacked inductors. Silicon structures are fabricated on a standard 28nm CMOS process and characterized with a network analyzer on folded GSGSG pads to facilitate rapid, one-touch measurements. The proposed de-embedding approach is compared with the conventional de-embedding approach. Additionally, the proposed...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.