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We have improved magnetic field sensitivities of poly-Si Hall devices by applying high voltages. We achieved the magnetic field sensitivity of 5.13 V/T by applying 580 V. This value is 1000 times higher than the previous magnetic field sensitivity.
This paper presents a new mathematical model for the walking beam reheating furnace scheduling problem (WBRFSP) in an iron and steel plant, which allows the mixed package of hot and cold slabs and aims to minimize the energy consumption and increase the product quality. An ant colony optimization (ACO) algorithm is designed to solve this model. Simulation results based on the data derived from the...
In the last years the Detector Technology group (PH-DT) [1] of the CERN Physics Department in Geneva, Switzerland, has started the study of novel micro-fluidic cooling systems obtained through standard micro-fabrication processes that outperform traditional cooling approaches for the thermal management of silicon particle detectors. The fabrication of the cooling devices starts with the etching of...
In this paper, we present a generic modeling study of the interposer package thermal performance as a function of the interposer thermal properties and thickness for different temperature specifications. The modeling study is based on an extensive DOE of thermal finite element simulations that extract the maximum allowable logic power as a function of the interposer properties. A graphical representation...
Enhancement of transistor drivability with suppressing short channel effect is a mandatory requirement for device scaling. In order to address the requirement, transistor structure transition from 2D bulk planar to SOI or 3D FinFET structures is now proceeding [1-4]. In FinFET structures, high dose tilt implantations are used in source drain extension formation. This implantations cause amorphization...
In this paper, thermal characteristics (Joule heating) induced by currents in short metal interconnect lines are studied. Electrical-thermal 3D-Finite Element Method (FEM) simulation is employed to model the property of temperature in short length metal lines and an empirical yet practical current model with metal line length effect is introduced. Consequently, the Irms current gain up to 25% in short...
As a result of the continuous miniaturization of integrated circuits, width and depth of Cu interconnects are reduced for every new technology node, implying that also the Ta or TaN Cu diffusion barrier and Cu seed layer must be thinned in order to avoid top feature pinch-off during Cu electroplating [1]. On the other hand, a reduction of Ta or TaN film thickness may also be desirable from a cost...
Commercial packaging roadmaps clearly depict the imminence of chip stacking utilizing through silicon via (TSV) technology (commonly referred to as 3-dimensional integrated circuits (3DIC)) as a means to improve system performance by reducing routing lengths, latency, and drive power while increasing functionality per unit volume. Roadmaps and packaging research focus areas also depict complex 3DIC...
Three-dimensional integration of multiple stacked silicon dies using Through-Silicon Vias has been recognized as a likely future direction of integrated circuit design. Yet, in contrast to previous architectures such 3D-ICs require extensive attention to thermal management from the moment of conception. Although such stacks are often associated with integrated, interlayer cooling solutions, it is...
This paper is aimed to the evaluation of interfacial thermal resistance between carbon nanotube and crystal of silicon by using molecular dynamics simulation. The calculations were executed by implemented algorithm for enforcing the heat flow in the model (PERL script language) in Forcite module of Materials Studio software (Accelrys, Software Inc.). Two models of the interface between carbon nanotube...
A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C3S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the Pmax of 1 × 104 Pa and Qmax of 38 µl/min. Cooling capability as high as 140 W/cm2 was demonstrated...
This paper presents the design, fabrication, and use of silicon nanowire (SiNW) arrays-patterned microcantilever sensors excited in the in-plane resonance mode to enhance the detection of airborne particulate matter (PM). Electrothermal excitation elements of p-diffused heating resistors were introduced in the current sensor system to replace the formerly used external piezoceramic stack actuator...
In this paper, a 1.2 kW DC-DC boost converter as a solar photovoltaic pre-regulator is designed to form the basis towards a comparative performance evaluation between similar ratings of 1200 V SiC BJT and Si MOSFET. The heatsink temperature and the measured switching waveforms are then compared by increasing the switching frequency up to 300 kHz and the case temperature up to 150 °C via a high temperature...
High temperature is one of the limiting factors and major concerns in 3D-chip integration. In this paper we use a 3D test chip (WIDEIO DRAM on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects. We correlated real temperature measurements with the power dissipated by the heaters using model learning techniques. The resulting compact thermal model is able to...
The soaring demand for computing power in our digital information age has produced, as an undesirable side-effect, a surge in power consumption and heat density for Multiprocessors Systems-on-Chip (MPSoCs). The resulting temperature rise results in operating conditions that already preclude operating all the cores at maximum performance levels, in order to prevent system overheating and failures....
We demonstrate, for the first time, the controlled coupling of rolled-up microtubes integrated with silicon waveguides by thermally tuning the coupling gap. Then we realize coupling modulation utilizing the dynamic tuning effect.
We demonstrate optical pulse compression by using two slow light in Si photonic crystal waveguide. Enhanced nonlinearity by slow light and tunable dispersion by integrated heaters achieved the compression from 8.6 to 2.6 ps.
Localized laser heating of amorphous Si deposited on LiNbO3 results in crystallization of the Si over-layer and the formation of a waveguide in the LiNbO3 substrate that supports guided modes in the visible and IR.
We introduce a general approach to radiatively lower the temperature of a structure, while preserving its color under sunlight. The cooling persists in the presence of considerable non-radiative heat exchange, and for different solar absorptances.
A tunable interior-ridge microring filter is demonstrated with a high quality factor of 1.5×105, while achieving a thermal tuning efficiency of 5.5µW/GHz. The filter demonstrates a record low insertion-loss <0.05dB over an uncorrupted 4-THz free-spectral-range.
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