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For wirebonded IC package, the industry has moved from conventional ~70um die pad pitch to ~40um pad pitch for better device and cost performance. In addition to the finer pitch challenge, thinner wires have also been introduced. These process advances have led to wire shorting and wire sweep being critical in package reliability and production yield. In this study, a DOE was designed to evaluate...
In the automotive industry, electronic systems are expected to perform well under harsh reliability conditions. There is an emphasis to continuously develop ball grid array (BGA) IC packages that perform increasingly well with respect to board level temperature cycling reliability. This paper is a study of three No-Clean Polymer Flux (NCPF) materials and evaluation of their performance relative to...
Flip Chip Ball Grid Array (FCBGA) package with large silicon chip and package size typically exhibits high warpage and coplanarity. Many percieved that such package design faced surface mount technology (SMT) challenges. In this study, the warpage characteristic and the SMT validation for such large package was investigated. A hybrid methodology utilizing both numerical and empirical data to predict...
PBGA (Plastic Ball Grid Array) has been around for years as the leading packaging technology for I/O controller. Occasionally PBGA package exhibits surface mount issues, typically the solder bridging, at very low defect per million. A series of investigation was carried out to address the key design modulators. This paper discussed the findings of how molding temperature could modulate the dynamic...
As the first interconnection element after the semiconductor chip itself, IC packaging technologies are the primary gate keepers of electronic system performance. There are a myriad of different types of packages available, each normally targeted for a specific range of semiconductor devices. With so many options, understanding the basics of IC packaging - how they are constructed, what drives cost...
When developing new MAPBGA package, package delamination was found after 96hrs autoclave test (121C, 100%RH, 15psig) through CSAM check and cross section analysis. MSL 3, 260C preconditioning was performed before the autoclave test. The improvement study was made on substrate power/ground gold ring design, substrate copper metal roughness and substrate metal layer design. Finally, the package delamination...
We developed a novel ball grid array (BGA) test socket for an integrated circuit (IC) package test. The fabricated test socket has a cantilever array structure based on a silicon-on-insulator (SOI) wafer. We used micro-electro mechanical systems (MEMS) technology to fabricate the test socket, which has a simple structure, an easy fabrication process, low contact force, rapid prototyping and low cost...
Board level drop test and thermal cycle are the keys qualification tests to ensure the solder joint reliability. It becomes critical due to leadfree solder. The work reported here explores the effect of underfill on drop test and thermal cycle reliability of area array packages, such as BGA's, CSP's, and WLCSP's. An unfilled underfill was found to provide superior drop test performance. Silica filled...
The ball grid array (BGA) has become one of the most popular packaging alternatives for high I/O devices in the industry with many advantages: high interconnection density and less packaging space and so on. In these days, the size of chip becomes small and the size of ball grid also becomes small, so the process of BGA alignment becomes more important and difficult. In this paper, the BGA alignment...
A fully integrated 40-Gb/s transmitter and receiver chipset with SFI-5 interface was implemented in a 65-nm CMOS technology and mounted in a plastic BGA package. The transmitter chip provides a good jitter performance with a 40-GHz full-rate clock architecture that alleviates pattern-dependent jitter. The measured RMS jitter on the output was 570 to 900 fs at 39.8 Gb/s to 44.6 Gb/s using a 2^31-1...
For the ultra fine pitch applications, solder paste printing acts as one of the most critical step in the SMT assembly process. A review of literature indicates that solder paste printing contributes around 60% of the total process defects. One of the key factors for the performance of solder paste deposition is stencil fabrication quality. Other important factors include stencil aperture design,...
Norris-Landzberg acceleration model, only applying the conditions of the temperature cycling tests such as temperature range, maximum of temperature and cycle times, has been widely using to predict the lifetimes of electronic packages since 1969, due to its simplicity not considering complex damage information such as stress-strain relationships. During the last few years, a number of researches...
Accelerated thermal cycling (ATC) test, though time-consuming, is currently the most widely used reliability test for electronic components. However, a much faster mechanical bend test is often adopted as an alternative for the ATC test. But it is a general guideline that the mechanical reliability test results are meaningful only if the mechanical stresses applied on the test components are either...
With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
Soldering is an important jointing technology in the electronic packaging industry. It has recently gained much more attention due to the Pb-free requirements and various emerging techniques, such as ball-grid array (BGA), flip-chip and through-silicon via (TSV). Although Sn-Ag-Cu solders are the most popular Pb-free solders, there are still various problems which need to be overcome. There are thus...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150 C thermal aging at different period...
The miniaturization and increasing complex integration of functional chips handheld devices such as cellular phones have led to the widespread adoption of chip scale packages (CSPs) and ball grid array (BGA) packages. Lighter weight, thinner thickness, smaller size, high I/O pins, low cost, high functions, high quality and green environmental material are trend of IC packages and continuously challenge...
The major purpose of the mechanical stress screening is to screen out the products which have potential defects which lie in materials, design, process, and operation etc. If the screening is thorough before the products are shipped, the rate of the abnormal failure at the users' side can be eliminated or lowered significantly. The manufacturing lot which goes through appropriate screening will have...
When the flip-chip packaging has been moving to the lead-free, fine-pitch and high-current-density packaging, the flip chip with copper-pillar-bump interconnects can provide a solution to this need. However, this package during the thermal cycling test (TCT) still suffers the reliability problems such as delamination at the Cu low-k materials or at the interface between the UBM (under bump metallurgy)...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
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