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The polymer cored solder interconnect has been investigated in board level strain concerned ball grid array type IC package for many years. The novel solder ball with a polymer core is designed to compensate the board level reliability weakness of current metal alloy interconnect such as mechanical and thermal-mechanical fatigue endurance due to its unique spherical polymeric core able to absorb the...
Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people's daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also,...
The conversion to lead free and halogen free materials have raised several new assembly and reliability issues. The reliability concern attaches gradually more importance to the pad cratering on Printed Circuit Boards (PCBs). The cracking happened on the laminate under the solder connect pads, known as pad craters, is the board level reliability issue related to mechanical stresses. We will establish...
QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end electronics product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and...
QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end electronics product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. The result shows the strain-controllable dynamic bending method can...
With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
The major purpose of the mechanical stress screening is to screen out the products which have potential defects which lie in materials, design, process, and operation etc. If the screening is thorough before the products are shipped, the rate of the abnormal failure at the users' side can be eliminated or lowered significantly. The manufacturing lot which goes through appropriate screening will have...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. The result shows the strain-controllable dynamic bending method can...
With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
The benefits of using the low Ag solder in CSP package has been known in terms of the performance due to its intrinsic characteristic. In this study, SAC alloy dopanted D1 and D2 are selected to compare with the general solder alloy, SAC105, in terms of thermal fatigue fracture performance. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB treated with 150°C thermal aging at different period...
With the more reliability requirement increasing in the IC packaging for mobile product, the testing condition to simulate the service life of IC packaging on board will be emphasized, such as mechanical drop, temperature cycling, bending, vibration and so on. 4 point cyclic bending condition including different bending frequency and displacement to simulate actual service condition is defined in...
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