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An advanced micromachining process has been developed to further enhance the performance and to reduce the size of mass-produced inertial MEMS. In this new platform technology two independent silicon layers instead of one can be used to form more complex 3D-like masses, springs, and free-standing electrodes. The first accelerometer generations for automotive and CE applications are already in series...
A back-side grinding CMOS-MEMS process is well established for thinning wafers down to tens of micrometres for use in stacking chips. As a result of the mechanical process, the wafer backside is compressively stressed. In this paper, authors investigate the influence of the backside induced stress in MEMS/CMOS wafers thinned down to 35∼275 μm by means of a micro-Raman technique. We found that the...
Ultra-short breakdown in the bulk of transparent materials has been intensively investigated in the last years, especially in dielectrics [1]. Whereas three-dimensional (3D) femtosecond laser micromachining in dielectrics is highly advanced, it remains extremely challenging in narrow bandgap materials such as silicon (Si). Recent numerical and experimental investigations show that only an underdense...
Microchips are more and more complex and designed in thick 3 dimensional packages. In order to access and characterize by electron microscopy (SEM and TEM) any detected defect responsible for malfunction of the device, a large quantity of matter needs to be removed without damaging the surrounded area. The available techniques, such as plasma Focused Ion Beam (FIB), allow achieving high quality surfaces...
This paper presents a novel, versatile process for the fabrication of wide and deep cavities for silicon MEMS devices without the need for wafer bonding. Instead of filling large trenches with sacrificial materials before encapsulation or directly using wafer bonding, we present a method that utilizes isotropic etching with XeF2 gas through a thin silicon dioxide film prior to the deposition of encapsulation...
This paper presents a new topology for a wire-grid antenna array which operates at 60 GHz. The array consists of ten λg/2 dipole radiators connected via non-radiating connectors. Both radiators and connectors are placed on top of narrow silicon walls. The antenna is fed with a coplanar microstrip lines placed at the other side of the wafer and is connected with its feeding transmission lines using...
Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as...
This paper presents a micormachined quarter wavelength monopole antenna operating at the millimeter wave band for automotive radar application, specifically at 77 GHz. The antenna will be realized using surface micromachining on a low resistive thick silicon substrate and fed by coplanar waveguide. Bulk micromachining is used to etch silicon underneath the antenna in order to reduce the Ohmic losses...
This paper presents an air-cavity-fed four-element slot antenna array, which is fabricated using a modified silicon micromachining process. Different from traditional silicon micromachining process, the silicon dielectric is fully plated with gold without any silicon being exposed to the electromagnetic environment. In this modified silicon micromachining process, air cavities can be easily obtained...
Transdermal drug delivery is an important approach due to its advantages of controlled release, easy wiping off, high safety and low degree of side effects. However, the efficiency and success of the drug delivery method is seriously hampered by the incapacity of many drugs to cross the skin at therapeutically useful rates. A microneedle approach can dramatically promote transdermal delivery, especially...
Using newly developed silicon micromachining technology that enables low-mass and highly integrated receivers, we are developing state-of-the-art terahertz spectrometer instruments for space-based planetary and astrophysics orbiter missions. Our flexible receiver with integrated antenna architecture provides a powerful instrument capability in a light-weight, low-power consuming compact package which...
In this paper, we have proposed a 60-GHz air cavity antenna array with checkerboard structure based on the MEMS silicon bulk micromachining technology. A one-to-four power divider with a Si-to-air transition is designed to excite an air-filled cavity antenna array. By properly arranging the four sub arrays, the proposed array is with a checkerboard structure. An in-phase radiating aperture which is...
This article presents the latest developments of our work related to a micro-lens antenna integrated in a heterodyne receiver using silicon micromachining technology at Terahertz frequencies. The antenna is composed of a waveguide feed which uses a leaky wave cavity to enhance the directivity and illuminate a shallow lens efficiently. The receiver is a dual-polarized balanced heterodyne detector using...
Using newly developed silicon micromachining technology that enables low-mass and highly integrated receivers, we are developing a state-of-the-art terahertz radiometer/spectrometer instrument for planetary orbiter missions to Mars, Venus, Titan, and the Galilean moons. Our flexible receiver architecture provides a powerful instrument capability in a light-weight, low-power consuming compact package...
An array of Circular Transmission Line Model (CTLM) metal contacts was deposited onto the upper surface of the n-SiC/Si chips using laser micromachining as an alternative to standard photolithography technique. Thin epitaxial n-type 3C-SiC/Si chips were used since no current leakage observed in previous studies. Various laser energies were used for the CTLM pattern transfer. Low values of ρc were...
Excimer laser micromachining enables us to overcome the conventional lithography-based microfabrication limitations and simplify the process of creating three dimensional (3D) microstructures. The objective of these study are to investigate the relation between frequency (f), number of laser pulse (P), fluence (F) and their etch performance. This paper presents a parametric characterization study...
We report a novel ultrafast burst mode fiber laser system, which can deliver pulses at ultra-high repetition rates in order to systematically investigate micromachining efficiency on copper and silicon samples.
In this letter, a WR-1.0 rectangular waveguide band-pass filter is designed, which is fabricated using the deep reactive ion etching (DRIE) micromachining on silicon wafers. The filter consists of four inductive irises. Using Ansoft HFSS, the center frequency of the filter is at 805GHz and the insertion loss is about 1.5 dB within the 21GHz bandwidth. Effects of the DRIE process brought to the filter...
WR-1.0 rectangular waveguide cavity band-pass filter based on micromaching technique is designed in this letter. The filter consists of two resonant cavities. A transmission zero is implemented by means of broaden stubs. The stub is broaden to the width of the resonant cavity, which simplify the fabrication. The proposed filter is fabricated using the deep reactive ion etching (DRIE) micromachining...
Silicon radiation sensors fabricated with micromachining technologies offer a number of advantages compared to their planar counterparts, making them appealing for an increasing number of applications. This paper provides an overview of the most interesting developments in this field by Fondazione Bruno Kessler in collaboration with the University of Trento.
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