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There are a number of final finishing technologies available in the market, each with different cost and performance attributes. The unique attributes of the Selective ENIG process have made it a popular choice for mobile device and high density interconnect (HDI) applications. This hybrid final finishing process combines the benefits of both ENIG and organic solderability preservative (OSP) processes...
Compared with widely used SAC305 (Sn-3.0Ag-0.5Cu) solder, low-Ag (Ag ≤ 1%) SAC solder obviously shows advantages in cost and mechanical impact resistance, and disadvantages in worse wettability, higher melting point and degeneration in electromigration, which restrict its application. Therefore, adding some suitable elements to the solder to improve the solderability and mechanical performance is...
Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent batch reflow suitable for high-volume production. AuSn solder was selected because of its fluxless bondability, good wettability, and self-alignment process...
For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch <; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
In this study, Ag/NiNiP-plated Cu leadframes from two different processes are compared in terms of NiNiP surface morphology, composition of NiP layer, grain structures of Ni and NiP plated layers, and impurities in the interface of Ni/NiP plated layers. Their impacts were assessed after solder plating and baking. Scanning electron microscopy (SEM) shows that the grain size of Leadframe A (from Process...
SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
Currently, consumer electronics, flexible and portable electronic products are the most popular because of further miniaturization accompanying more functionality per device and low costs. To produce high volume, high-density interconnect substrates, flexible printed circuits (FPCs) will become more and more important. For the fabrication of FPCs, polyimides (Pis) possess many outstanding properties,...
A Cu/Ni UBM and Sn-2.5Ag lead-free solder for 20 μm pitch micro-bump was successfully fabricated via consecutive electroplatings of Cu, Ni, and binary SnAg. Materials characterizations such as Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), Electron Probe Micro-analyzer (EPMA), and X-ay Photoelectron Spectroscopy (XPS) were carried out to obtain relevant materials properties. We observed...
The purpose of this work was to compare the mechanical and physical properties for 0.5% Niobium alloyed ductile iron (0.5% Nb-DI) with commercial ductile iron (DI) before and after austempering process. The materials for this investigation were produced by conventional CO2 sand casting process and machined to TS EN 10001 standards for tensile test and ASTM E23 for Charpy impact test. Hardness test,...
Catalytic ozonation of p-chlorobenzoic acid (p-CBA) in aqueous solution has been carried out where transitional metal (Ni, Cu, Mn, Co, Fe) supported activated carbon was used as catalysts. Ni supported activated carbon ( Ni/AC) catalyst, which is prepared by the dipping method with an aqueous solution of Ni(NO3)2, shows higher catalytic activity. Activated carbon and Ni/AC catalyst were characterized...
This investigation has achieved semi-uniform coatings of single-walled carbon nanotubes (SWNT) onto copper substrates by electrodeposition from a metallic plating bath as well as electrophoretic deposition. Furthermore, SWNT mat was used as an electrode in which metallic ions were electrodeposited. CVD-produced SWNT were functionalized via agitation concentrated sulfuric acid/nitric acid. FTIR studies...
An electro-thermal SU-8 cantilever micro actuator with large vertical motion at low voltage is presented in this paper. It is lower in voltage due to employing SU-8 as functional material because of its high coefficient of thermal expansion. A finite element simulation was utilized to determine the optimal parameter. Windows in the center of cantilever can reduce internal residual stress. And we also...
This paper describes a novel local heating technique for microelectronic mounting. Aluminum/nickel (Al/Ni) multilayer foils show self-propagating exothermic reactions, driven by a reduction in atomic bond energy which can provide rapid bursts of heat and can act as a local heat source to melt solder layers and join materials. In this work, we demonstrate the validity of the Al/Ni reactive foils as...
The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes...
The wetting behavior of Sn-Ag-Cu solder ball on nickel pad has been studied. SEM and EDX were employed to analyze the solder joint interfacial microstructure. Three zone-reactive wetting ring structure was found at the interface. To further study this kind of structures, solder ball attachment (SBA) and surface mount technology (SMT) were performed to prepare more samples. Experimental results show...
SiC power devices were die bonded to a AlN/Cu/Ni(Au) direct bonded copper (DBC) substrate with a Au-Ge eutectic solder in a vacuum reflow system. The long term joint reliability of the bonded chips was evaluated at 330degC in air for up to 1600 hours. The bonded samples were inspected with a micro focus X-ray TV system. The microstructure of the samples was observed and analyzed by the scanning electron...
Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrerpsilas formula...
SnPb solder joints are an essential part for microelectronic packages manufacturing industrial for a long time. In recent year, environmental concerns and RoHS (Restriction of Use of Hazardous Substances) has demanded elimination of lead from electronics products by July 1, 2006. However, base on increasing pressures to achieve environmentally friendly electronic materials and processes, and indeed,...
As lead free solders are being implemented in commercial electronic goods, reliability of electroless Ni(P)/Pb-free solder joint has become an important issue because formation of Ni3P and Ni3SnP at solder/UBM interface increased the susceptibility to brittle cracking through these layers. In this report, composition of electroless Ni(P) under bump metallization(UBM) was modified by co-depositing...
Soldering with lead-free tin-based solder alloys demands substantially higher processing temperatures compared to conventional tin-lead solders, resulting in both significantly greater growth rates of Intermetallic Compounds (IMCs) and dissolution of surface finish layers. In this paper, the interfacial reactions between a new lead-free solder composition, eutectic Sn-0.7Cu- 0.4Co, and Electroless...
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