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In many communications applications semiconductor devices operate in a pulsed mode, where rapid temperature transients are continuously experienced within the die. We proposed a novel junction-level cooling technology where a metallic phase change material (PCM) was embedded in close proximity to the active transistor channels without interfering with the device's electrical response. Here we present...
MOSFETs in an RF amplifier dissipate high heat flux due to switching and conduction loss. MOSFET's junction temperature affects product reliability adversely. This paper presents a thermal management method used in an RF amplifier development with junction to case temperature rise transient analysis, Thermal Interface Material (TIM) testing, clamping structural Finite Element Analysis (FEA), and Computational...
This paper discusses the use of the second law in heat sink design. A new entropy-based cost function is proposed and compared with existing heat sink cost functions. A case study of a plate fin heat sink points out that this newly developed cost function offers a heat sink which is more than twice as efficient as a heat sink designed with the traditional thermal resistance minimization objective...
The need for accurate trace level modeling is emphasized, by comparing simulated junction temperatures of a SMT package on a PCB under different combinations of trace layout. The results show that detail modeling of traces around the device has a significant impact on the predicted temperatures and over-simplified PCB models can cause unacceptable errors.
Technological advances driven by the DRAM market demands resulted in thermal challenges arising from increasing power and decreasing space for cooling. This is exacerbated by the packaging of multiple devices within the same footprint based on die stacking or package stacking. In view of the thermal concerns, we conducted a comprehensive thermal study of chip stack and package stack devices at both...
In the embedded wafer-level packaging field, the embedded micro wafer level package (EMWLP) technology leverages on fan-out redistribution connections, keeping the reliance on wire-bonding and flip-chip bump connections to a minimum, thus streamlining the packaging process. As the embedded micro wafer level packaging (EMWLP) technology evolves to capitalize on package-on-package (POP) technology,...
The trend for package size shrinkage has created challenges to thermal performance while improving the cost performance. When TO package size shrink by minimizing the leadframe copper usage, challenges in package warpage and thermal contact become great. TO High Creepage (a shrink version of new generation TO247) introduced difference copper thicknesses at die pad and heatsink for better material...
This paper will act as a definitive guide on how the Junction to Case thermal resistance (RthJC) of an IGBT device is measured. This paper would provide an overview of the measurement circuit and the methods used in the measurement of an IGBT device housed in the T0247 package. We shall discuss the theory and formulas used to derive the thermal resistance of the device using the measured data. paper...
In this paper we present the thermal analysis and reliability performance of high power light-emitting diodes (LEDs) with silicon carrier packages. The junction temperature of LEDs is an essential reliability parameter. Exceeding the maximum raised junction temperature could lead to light output degradation and sometimes even to destructive failure. Therefore thermal management and proper thermal...
One of the major drawbacks in the typical design flow of electronic equipment is the lack of synchronization between design stages. Schematic design and thermal management are rarely correlated, although electrical and thermal parameters are very closely linked. Poor thermal design can have severe consequences on the reliability and functionality of the equipment and is often the main cause of component...
Active heat dissipation method plays a vital role in thermal management of high power light emitting diode (LED) packaging. As a new cooling device, thermoelectric cooler (TEC) is applied in electronic packaging, for which the extensively applied devices are the heatsink and the fan by now. In order to evaluate the cooling performance of the heatsink and TEC, three different cooling models for light...
Thermal design is necessarily to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of packaging device was studied using FEM, for example, phase shifter and LED. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simulation shows tendency as tested experiment results, verifying the correctness...
Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die,...
Concentrator solar cells are almost always characterized near room temperature (RT) conditions, but are operated at system-dependent elevated temperatures in the field. Cell designs that are optimized for RT can quickly lose their advantage at higher temperatures. Cell designers have traditionally considered thermal management to be the problem of system designers, but some initial consideration of...
Power Quad Flat No-lead (PQFN) packages are extensively used in automotive applications. Features such as solder die attach material, thick copper lead frame, exposed heat sink and heavy gauge aluminum wire, are adopted to ensure good thermal management and reliability performance. Solder voids, cavities formed between power die and lead frame during solder reflowing process, are major defects in...
In this paper a setup for performing power cycling tests of IGBT modules for the purpose of reliability analysis is presented. The main purpose of the setup is to provide experimental data for the parameterization and verification of a newly developed physical model of solder deformation leading to the failure of power electronic devices. The design procedure, including considerations of reliability,...
Investigations in this work are connected with design of energy effective multifunctional lamp for interior lighting. A mechanical construction of a desk lamp is used. LEDs are chosen as light sources. Characteristics of LEDs allow creating lightweight construction which can serve as: desk lamp (light flux about 600 ÷ 700 lm); night light for baby room (light flux about 100 ÷ 200 lm) and lamp for...
Investigations deals with optimization of operating regimes of LEDs in lighting equipment for obtaining two purposes - maximum light output in dependence of ambient conditions and long term lumen maintenance. Thermal management calculations and heat sink choice are experimentally tested at various ambient conditions (air temperatures from 20oC to 55oC) and different current values through LEDs - up...
This paper presents methods for determining power loss profiles of Si-IGBT-based inverters and the induced junction temperature. Power losses were decomposed into different waveforms in order to investigate their influence on the junction temperature of the IGBT. Junction temperature has been determined by a dynamic thermal model using the transmission matrix technique.
Flip-chip designs offer several advantages over traditional designs. However, thermal characteristics must be considered carefully, or the end result may have high junction temperatures and thus poor performance and poor reliability. This paper presents some guidelines for thermal optimization in flip-chip designs, and presents the results of a flip-chip single die WiFi FEM developed using Bi-FET...
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