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The continuous push for smaller bump pitch interconnection in line with smaller Cu/low-k technology nodes demands the substrate technology to support finer interconnection. However, the conventional organic buildup substrate is facing a bottleneck in fine-pitch wiring due to its technology limitation, and the cost of fabricating finer pitch organic substrate is higher. To address these needs, Si interposer...
Three dimensional integrated circuits offer significant advantages over single chip packages in terms of functionalities and footprint needed. A key technology to enable the adoption of these advanced packages in electronic systems is Through-Silicon-Via (TSV). The use of TSV has realized integration in the vertical domain. However, as more dies are stacked within the package, the heat generated has...
In the embedded wafer-level packaging field, the embedded micro wafer level package (EMWLP) technology leverages on fan-out redistribution connections, keeping the reliance on wire-bonding and flip-chip bump connections to a minimum, thus streamlining the packaging process. As the embedded micro wafer level packaging (EMWLP) technology evolves to capitalize on package-on-package (POP) technology,...
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