The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The paper prepared and experimentally studied the thermal properties of paraffin binary mixtures and fatty acid binary mixtures. These binary mixtures have suitable phase change temperature and big phase change latent heat for wall. The phase change temperatures and latent heats of the phase change materials were tested by differential scanning calorimeter(DSC) after multiple heat cycle. The testing...
Polyethylene oxide (PEO) is a water-soluble polymer often used as a model system to observe filler effects. This paper details an investigation into the physical, thermal and electrical properties of thermally aged PEO. Three molecular weight host PEOs were tested for thermal ageing resistance - 100,000 g mol-1, 400,000 g mol-1 and 1,000,000 g mol-1. Thermally aged 100,000 g mol-1 molecular weight...
The thermal and electrical properties of Fe-based amorphous alloys Fe80-xCoxP12B4Si4. Thermal property and stability were studied by DSC and the glass transition temperature were also determined. The electrical resistivity were measured and showed that an electron-phonon interaction varies on the resistance changes.
Graphene, as a rising star in material science, has recently attracted extensive scientific and technological interest owing to its strictly two-dimensional structure and extraordinary electronic, thermal and mechanical properties [1-3]. Chemical approaches, as a low cost method, could produce large-scale production of graphene, which will speed up the application of graphene. In this paper, graphene...
In this research, epoxy resin was modified by amine-terminated polyimide (ATPI) prepolymer for improving both thermal and mechanical properties of electronic packaging materials. The ATPI was synthesized with polyester and pyromellitic dianhydride (PMDA), p-toluene sulphonic acid (PTSA) as catalyst and characterized by FT-IR spectrum and DSC. The ATPI modified epoxy resin (AME) was cured by 4, 4-diaminodiphenyl...
CNT/LiNi0.33Mn0.33Co0.33O2 nanocomposite electrode material was fabricated for Lithium Ion Battery. Sol-Gel synthesis has been used to synthesize the nano-sized pristine LiNi0.33Mn0.33Co0.33O2 (LNMC). CNT/LiNi0.33Mn0.33Co0.33O2 nanocomposite has been synthesized by using low temperature dispersion method. Structural characterization of the material has been performed by using X-ray diffraction, which...
Polyethylene oxide (PEO) is a water-soluble polymer often used as a model system to observe filler effects. This paper details an investigation into the physical, thermal and electrical properties of polyethylene oxide composites containing micro-(SD) and nano-silicon dioxide (nSD) filler. Three molecular weight host PEOs were used - 100,000 g mol-1, 400,000 g mol-1 and 1,000,000 g mol-1 and the SD...
In order to supply high quality silver source to photothermographic materials based on silver carboxylate, silver plamitate was prepared by chemical deposition method using palmitic acid, sodium hydroxide, silver nitrate as raw materials and PVP as surfactant. The effects of experimental conditions such as reaction system, reaction temperature, reactant concentration and amount of PVP were investigated...
In this paper, we discuss a unique combination of experimental analyses employed to monitor, understand, and ultimately eliminate micro voids formation in the epoxy matrix of flip chip underfill during curing. Present day flip chip packages require the use of underfill epoxies to achieve reliable C4 bumps solder joints on the board level. Many different types of underfill epoxy chemistry have been...
High density polyethylene HDPE/SiO2 nanocomposites were prepared by melt compounding using a twin screw extruder. The thermal properties of the composites were investigated by differential scanning calorimetry (DSC). The microstructures of nanocomposites were characterized by scanning and transmission electron microscopy (SEM and TEM). The dielectric breakdown strength of the nanocomposites was investigated...
Polyethylene oxide (PEO) is a water-soluble polymer that is widely used as a model system to examine fundamental processes. This paper details an investigation into the physical, thermal and electrical properties of PEO-based nanocomposites containing a highly hydrophilic boehmite nanofiller. The boehmite was dispersed into the PEO in solution in distilled water, by using controlled shear conditions,...
This research work investigates the effect of 0.5 wt%, 1.0 wt% and 1.5 wt% Sb addition in 96.8 wt% Sn 2.5 wt% Ag 0.7 wt% Cu. Addition of Sb has shown significant effect on metallography, wettability (using ZnCl2 as flux), thermal properties as well as mechanical properties of the SnAgCu solder. The wettability test has been carried out using Cu as substrate by varying the solder temperature. A good...
Tin/silver alloy nanoparticles with various sizes were synthesized by the chemical reduction method and their thermal properties were studied by differential scanning calorimetry. Both the particle size dependent melting temperature and latent heat of fusion have been observed. The melting point can be achieved as low as 194degC when the diameter of the nanoparticles is around 10 nm. The 64 nm (average...
A series of polyimide-clay-siloxane hybrid films with siloxane content up to 50% were successfully prepared by the sol-gel reaction of diethoxydimethylsilane (DEDMS) in the presence of poly(amic acid). XRD indicated that the organically modified montmorillonite(OMMT) layers were exfoliated and dispersed into the poly(amide acid) and polyimide film. The films were yellow and transparent when the siloxane...
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and differential scanning calorimetry (DSC) respectively. Overall results indicates that Sn3.8AgO.7Cu having the most favorable results with...
In the paper, PEEK(poly(ether ether ketone)) was added to the epoxy resins as a modifier to improve thermal and mechanical properties of the cured resins. The heat effects of curing epoxy resin composites with PEEK were investigated by differential scanning calorimetry (DSC) technology and the morphologies of the fracture surface by scanning electron microscope (SEM). The relationship between the...
Tin (Sn) nanoparticles with various sizes were synthesized from a chemical reduction method. Their morphological and thermal characterizations were studied. The high resolution transmission electron microscopy (HRTEM) study showed that significantly low level of oxides was formed. The thermal characterization by differential scanning calorimetry (DSC) exhibited the size dependency of the melting points
A novel photo-curable nanocomposite material which can act both as a photoresist and a stress redistribution layer applied on the wafer level was synthesized and studied. In the experiments, the 20nm silica fillers are modified by silane coupling agent through the hydrolysis and condensation reaction and then incorporated into the epoxy matrix. A photo-sensitive initiator is added into the formulation...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.