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The paper summarizes the development of a standard to measure the thermal resistance “junction-to-case” θJC of semiconductor devices with heat flow through a single path. Power switches or amplifiers are typical examples. θJC is a key performance metric to decide whether a device can be used in thermally critical applications. Hence an accurate and reproducible method to measure θJC is required. This...
Measuring the case temperature is one of the most challenging measurements for determining the junction-to-case thermal resistance (Theta jc) in high power packages. This is especially true for low Theta jc measurement, in which high power is necessary to control accuracy. Inaccurate case temperature measurement would lead to an inaccurate Theta jc value. This study explores different methods for...
The junction-to-case thermal resistance Rth-JC is an important thermal characteristic for power semiconductor devices. Its value is often one of the main criteria for the decision whether a device can be used in a thermally demanding environment, and a low Rth-JC therefore is a competitive advantage for the semiconductor manufacturer. On the other hand the vendors must ensure that their data-sheet...
This paper will act as a definitive guide on how the Junction to Case thermal resistance (RthJC) of an IGBT device is measured. This paper would provide an overview of the measurement circuit and the methods used in the measurement of an IGBT device housed in the T0247 package. We shall discuss the theory and formulas used to derive the thermal resistance of the device using the measured data. paper...
Traditional thermal conductivity measurement such as laser-flash method for thermal-conductivity measurement is limited to homogenous materials or limited geometry, therefore, such method is not suitable for characterizing real semiconductor packages which have complex heat flow structure. In this paper, we are going to introduce structure function based evaluation of the thermal transient measurements,...
In this paper the accurate and fast measurement equipment was developed and applied to study the thermal characteristics of high power LEDs. The forward-voltage based method was conducted to measure the junction temperature of high power LEDs. Conduction type method is adopted to measure the temperature sensitivity parameter (TSP) with small magnitude of error compared with the traditional method...
Nowadays the quality of thermal interface materials (TIM) has a growing importance as the increasing dissipation level of ICs requires more and more sophisticated solutions to reduce the Rth along the heat-flow path. The recent approach of TIM manufacturers is to use nanoparticles as fillings in TIM materials, in order to enhance considerably the TIM thermal conductivity. On the other hand this solution...
The accurate and reproducible measurement of the junction-to-case thermal resistance Rth-JC of power semiconductor devices is far from trivial. In the recent time several new approaches to measure the Rth-JC have been suggested, among them transient measurements with two different interface layers between the package and a heat-sink. The Rth-JC can be identified either in the structure functions or...
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