Search results for: Ming-Ji Dai
Microelectronic Engineering > 2014 > 120 > Complete > 114-120
Microelectronic Engineering > 2014 > 120 > Complete > 194-199
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 9 > 1407 - 1419
Applied Thermal Engineering > 2013 > 51 > 1-2 > 75-83
Journal of Electronic Materials > 2013 > 42 > 7 > 2362-2370