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In this work, we demonstrate both high-frequency (1.12 MHz) MEMS tuning fork resonators and lower frequency (39kHz) MEMS test devices capable of withstanding large magnitude inertial shocks. These devices reliably continue to function after the application of repeated inertial shocks in excess of 20,000g. The device performance, and the robust, pure silicon encapsulated environment are both preserved...
For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using...
Beam structure is widely used for MEMS (Micro-electromechanical Systems) design, the mechanical properties of beam structure are of great importance to guide the design of MEMS devices. Among the many properties, stress rupture properties are studied in this paper. The sensor based on piezoresistive effect with a specially designed cross-beam structure is proposed for stress rupture properties measurement...
Progressive cardiac diseases due to population aging lead to stimulate research and innovation. Moreover, recent development in the miniaturization of microsystem offers a tremendous opportunity for medical implantable application. This paper introduces a new technology that integrates a Micro Electro-Mechanical Systems (MEMS) accelerometer and an Application-Specific Integrated Circuit (ASIC) inside...
In order to excite silicon microcantilevers under the temperature ranging from room temperature to 500°C, an impact base excitation device was developed. In excitation device, an electric heating plate is used as the heating element to heat the testing microstructure. A separated structure was designed to protect the piezoelectric ceramic apart from the damage due to the high temperature. Using the...
The objective of this paper is to present a new technology that integrates a Micro Electro-Mechanical Systems (MEMS) accelerometer and an Application-Specific Integrated Circuit (ASIC) chip encapsulated in a hermetic silicon box that could be embedded in a transvenous cardiac lead in order to sense the endocardial acceleration signal. The originality of the approach consists of using an interposer...
This paper reports the comparison among the results obtained by various types of testing for evaluating fatigue lifetime of silicon specimens, performed in 6 institutions in Japan. The experiment covers a variety of single crystal silicon (SCS) specimens fabricated on the same SOI wafers with 5 μm device layer thickness as well as additional specimens made separately in some institutions. In summary,...
With the developed process, four MEMS tensile testing chips of <;110>;-oriented single crystal silicon (SCS) nanobeams were achieved in one SOI wafer with thickness from 45 to 100 nm. Mounting the chips onto a custom made TEM sample holder, which integrated also comb drives and force sensor beam, in-situ TEM tensile tests were carried out. The measured Young's modulus (from 74 Gpa to...
In this study, we use the standard TSMC 0.35 μm 2P4M process to design CMOS-MEMS probe chip. MEMS technology involves the following steps such as lithography process, electroless nickel (EN) plating process, grinding process and dry etching process. The probe chip has through silicon via (TSV) package structure, and the combination of CMOS process within the multi-layer interconnections, which could...
This paper presents a rotary MEMS ball bearing with an integrated silicon ball cage. The device is a deep groove radial ball bearing consisting of steel balls encapsulated between two micromachined silicon wafers. The silicon ball cage is released from the bulk silicon substrate during fabrication. The objective was to show that a simple caged bearing design provides reliable motion at both high and...
Micro- and nano-electromechanical systems are typically formed via lithographic and etching processes that leave residual surface features, stresses, and chemistry that ultimately control component strength and thus device and system reliability. Here, we describe a new test specimen for micro-scale tensile strength measurements that allows for direct assessment of surface effects on strength. Specimens...
In-situ tensile testing in EM (electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quantitative information on sample deformation at atomic scale. In this work, MEMS tensile-testing chips with differently thick <110>-oriented SCS nanobeams were designed, fabricated and utilized in SEM and/or TEM to manipulate SCS nanobeam and measure...
In this paper, we present a novel packaging technique that utilizes a simple, flexible parylene (chip) pocket on silicon substrate with metal pads. This pocket can house an IC chip or a discrete component inside and provide electrical connections to it. On the other hand, recent achievement in silicon probes implantation in the parietal cortex enables technological advances in neural prosthesis research...
Metal MEMS structures can be formed by metal electroplating with the aid of thick-photoresist molds. The microfabrication features low-temperature process that is post-CMOS compatible and can be used for on-chip integration of high-performance RF parrives for RFICs. On the other hand, The plating process can be combined with silicon micromachining techniques to build operation tools, like probe-cards,...
In-situ tensile testing in TEM (transmission electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quantitative information on sample deformation at atomic scale. This paper reports an in-situ tensile testing on a 90 nm-thick <110> SCS nanobeam in TEM JOEL 2010 by using a self-made TEM holder and an MEMS tensile-testing chip. A suspended...
Based on the analysis of compensation theory for non-drive structural silicon micromachined gyroscope, the programming and the debugging of software and the contrast of actual gyroscope output signal and compensated output signal, the feasibility of this non-linearity compensation algorithm is proven. Compensation errors based on this algorithm are proven to be tiny and the accuracy is proven to be...
One kind of non-linearity compensation technology algorithms for non-drive structure silicon micromachined gyroscope is proposed in this article. Based on the analysis of compensation theory, the programming and the debugging of software and the contrast of actual gyro output signal and compensated output signal, the feasibility of nonlinearity compensation algorithm is proven. Compensation errors...
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