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Nanosilver paste has become a promising lead-free die-attach material for power electronic packaging. This development solves the challenges faced by power device manufacturers to replace the lead-based or lead-free solders for high-temperature applications. This paper proposes the reliability of a 1200-V/150-A multichip insulated-gate bipolar transistor (IGBT) module using pressureless sintering...
This paper describes the design, construction and performance of a 5 kVA aviation power module containing silicon carbide MOSFETs. The function and control of this module within a commercial aviation power electrical control unit (ECU) application is explained and the power dissipation benefits from the use of these MOSFETs instead of silicon IGBTs when driving an electrical motor controlling an aileron...
A newly IGBT module combined with liquid epoxy resin encapsulation and insulating metal baseplate (IMB) has been developed. IMB is insulating sheet with thick baseplate, and has large mounting area compared to ceramic substrate. The properties of liquid epoxy resin such as glass transition temperature, coefficient of thermal expansion, long-term thermostability are optimized for employed metal baseplate...
In this paper, a 1200-V, 150-A IGBT module was designed and fabricated using the nanosilver paste without additional pressure. Comparative tests on thermal-cycling aging were studied between the as-prepared IGBT modules and the commercial modules using high-temp solder. The results indicated that, by the thermal cycling test, the thermal resistance and on-state resistance of the as-prepared IGBT module...
The current trend in the global automotive industry toward eco-friendly mobility will continue to grow in the future. At the same time the most important challenge for automotive electronics is to manage increasing electronic power within smaller devices. Power electronic modules have to be placed close to the electric motor or — for hybrid electronic vehicles — close to the combustion engine. Further...
Recently the main requirements found in the market are further downsizing and higher efficiency of power conversion systems. Enhanced power density of the power modules will be the key to succeed. The increasing package reliability in higher junction temperature operation will be the major challenge. By further improvement of the chip characteristics and the development of new high reliability package...
Major requirements for power conversion systems are “further downsizing” and “higher efficiency”. Enhanced power density of the power modules will be the key to succeed. Higher reliability in continuous high-temperature operation will be the major challenge. The performances of the modules were significantly improved by further improvement of the chip characteristics and the development of new high...
Substrates for high power electronic systems are dominated by DCB-technology. Recently, new copper thick-film pastes have been proposed for use as high power substrates. They are compatible with Al2O3- and pre-oxised AlN-substrates. This paper investigates production processes to build up highly reliable power modules and explores basis electrical and thermal properties of thick-film copper substrates...
We developed a new technology for the Fuji 4th generation power module for hybrid vehicle application. It achieved a 30-% volume reduction, and a 33-% weight reduction compared to the 3rd generation. Requirement trends for the power module for hybrid vehicles are high energy-efficient, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance...
Recent advances of GaN Gate Injection Transistors (GITs) and their applications to power switching systems are reviewed. The GITs are fabricated on cost effective Si substrates in a large diameter up tp 6inch, which exhibit normally-off operations by the use of p-AlGaN over an AlGaN/GaN hetero-junction. The GIT is free from the current collapse up to 600V enabling reliable operation of the power switching...
In the field of IGBT modules, there is currently a plethora of new packaging materials being developed with a view to increased “reliability”. Whilst this approach is often essential to meet the needs for the ever increased demand in harsher environments, the result can often be seen as an over-engineered solution with resultant excessive cost. This paper will present a case study addressing how process...
Comparing to the most common reliability tests this work presents a new approach of accelerated testing, by combining temperature, humidity and pressure cycling with voltage stress. A design of experiments methodology has been proposed to test IGBT inverters and understand environmental factors effect. The humidity-pressure combination effect is studied for various IGBT inverter packaging materials.
The lifetime of an IGBT power electronics module under cyclic temperature loading conditions has been analyzed using finite element analysis method. The failure mechanisms that have been taken into account are the fatigue of the chip-mount-down solder joint, the substrate attach solder joint, the busbar solder joint and the Aluminum wirebond. The results show that the lifetime of the module is about...
This paper presents a novel interconnect technology and packaging solution for silicon power devices, along with the virtual prototyping tool created to develop the concept and optimize it in terms of reliability. The technology is based on the use of bumps (i.e., conductive spheres or cylinders) to connect the surface of vertical power components and is characterized, in comparison with standard...
A self-isolating, lateral IGBT device with high voltage blocking capability (>700 V), high on-state current density (150 A/cm2 at Vds=4 V) and very fast turn-off (< 50 ns), realized in membrane on bulk Si technology is reported here. The device has been manufactured using a standard 5 V, 0.35 mum bulk CMOS process on 8" wafers with the addition of two masks: i) n-drift for the HV blocking...
Liquid jet impingement can be used to efficiently generate high heat transfer coefficients for cooling. However, optimization of the jet impingement array is complicated as a large number of geometrical parameters, such as array size, jet spacing and jet diameter affect performance. In the studies described in this paper a custom designed half-bridge substrate tile, supporting two IGBT and two diode...
In order to meet the through-life reliability targets for power modules, it is critical to understand the response of typical wear-out mechanisms, for example wire-bond lifting and solder degradation, to in-service environmental and load-induced thermal cycling. Application of accurate wear-out models can identify the dominant failure mechanisms at the design stage and can be employed in reliability...
Health management and reliability form a fundamental part of the design and development cycle of electronic products. In this paper compact real-time thermal models are used to predict temperatures of inaccessible locations within the power module. These models are then combined with physics of failure based reliability analysis to provide in-service predictions of crack propagation in solder layers...
A planar edge termination technique of trenched field limiting ring is investigated by using 2-dimensional numerical analysis and simulation. The better voltage blocking capability and reliability can be obtained by trenching the field-limiting ring site which would be implanted. The trench etch step makes the junction depth deeper so that junction curvature effect and surface breakdown are less happened...
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