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3D IC packages with stacked silicon interconnects (SSI) have many performance advantages over conventional flip chip packages. Using SSI, various die using the same or different technology can be connected to each other with the use of an interposer. The interposer allows a large number of die-to-die connections, enabling higher interconnect bandwidth, lower power consumption, and lower I/O latency...
Thin film polymers play an essential role in system integration. The mechanical properties of the polymers are crucial for 3-D-Integration and advanced WLP because with the thinning of the silicon wafers, i.e. chips to less than 150 μm, the influence of the polymer layers gets an increasing impact on the mechanical stability of the electronic device. Next generation polymers have entered the market...
In the automotive industry, electronic systems are expected to perform well under harsh reliability conditions. There is an emphasis to continuously develop ball grid array (BGA) IC packages that perform increasingly well with respect to board level temperature cycling reliability. This paper is a study of three No-Clean Polymer Flux (NCPF) materials and evaluation of their performance relative to...
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