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Inorganic glass is promising material for carrier substrate of fan-out WLP and PLP process due to its stiffness, optical transparency, heat resistance and flatness. In addition, adjustability and flexibility of coefficient of thermal expansion is exceptionally useful to suppress warpage after molding process. In this paper, technical features of glass will be described.
The analysis of self-heating effect in a SOI LDMOS device under an ESD stress is presented in this paper. TCAD tools are used as the platform to explore the physical process of the bulk LDMOS device and the influence of buried oxide layer inserted in the substrate. Simulation results uncover that the buried oxide layer degrades the current-handling ability and changes the lattice temperature distribution...
With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly...
Changing the future lighting, Konica Minolta has been making progress in the research and development of flexible OLED toward commercialization. We had continuously showcased flexible OLED demonstration model, and announced our mass production plan of the flexible OLED using plastic barrier film. We have originally developed barrier film, and successfully achieved ultra-thin flexible OLED using 25μm-PET...
Cu Column bump has seen growing adoption in both high-end and low-cost mobile devices as well as in consumer, computing and networking devices. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bump on lead (BOL), while higher performance requirements are driving increased current densities, thus making electromigration...
Compliant interconnects have been studied in universities and industry over the past decade, as compliant interconnects could mechanically decouple the die from the substrate and thus could reduce the stresses in the die. In this work, we present the design, fabrication and modeling results of three-path electroplated compliant interconnect that addresses several of the challenges associated with...
The thermal stress and mechanical induced reliability issues of the Mo layer deposited on polyimide (PI) flexible substrate are studied. We found that the CIGS film cracks after one-hour 400°C selenization process. And the CIGS crack was initiated from the cracking of the Mo film and it can be improved by a Mo annealing process before the precursor deposition. Lower the ramping rate of the selenization...
We proposed a novel approach to quantitatively estimate the strength of cell-material interaction by using microfluidic system. The microfluidic device was made of poly (dimethylsiloxane) chip bonding on the temperature-responsive cell culture surface consisted of poly(N-isopropylacrylamide) (PIPAAm) grafted tissue culture polystyrene (TCPS) (PIPAAm-TCPS), containing five parallel test channels for...
Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller...
Change in resistance of interconnect traces on flexible substrates is dependent on material properties and mechanical stress imposed by tensile strain. Dedicated test structures and a mechanical flexing / data collection system were designed and fabricated to collect time to failure data based on cyclic loading to different radii of curvature. We propose a life-stress model based on an inverse power...
Due to the advantages of small-footprint, short-lead, high performance, high-packaging-density and thin profile, flip-chip-on-board (FCOB) technology is becoming an attractive choice in todaypsilas high density electronic packaging industry. With the trend toward lead-free and miniaturization in consumer electronics, the fatigue reliability of the small size lead-free FC solder joint on low cost PCB...
A numerical modelling method for the analysis of solder joint damage and crack propagation has been described in this paper. The method is based on the disturbed state concept. Under cyclic thermal-mechanical loading conditions, the level of damage that occurs in solder joints is assumed to be a simple monotonic scalar function of the accumulated equivalent plastic strain. The increase of damage leads...
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
Transconductance (gm) enhancement in n-type and p-type nanowire field-effect-transistors (nwFETs) is demonstrated by introducing controlled tensile strain into channel regions by pattern dependant oxidation (PADOX). Values of gm are enhanced relative to control devices by a factor of 1.5 in p-nwFETs and 3.0 in n-nwFETs. Strain distributions calculated by a three-dimensional molecular dynamics simulation...
Reduction in component size and higher ambient temperature conditions are two of the main causes of increased thermal stresses placed upon electrical insulation materials. By virtue of its simplicity in use, pressure-sensitive adhesive (PSA) tape offers the end user economy, versatility, and speed. Although PSA tape constitutes only one component of an insulation system, its ability to operate effectively...
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