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With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly...
We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.
Compliant interconnects have been studied in universities and industry over the past decade, as compliant interconnects could mechanically decouple the die from the substrate and thus could reduce the stresses in the die. In this work, we present the design, fabrication and modeling results of three-path electroplated compliant interconnect that addresses several of the challenges associated with...
To achieve ultra small form factor package solution, an ultra-thin (50µm) Si interposer utilizing through-silicon-via (TSV) technology has been developed. Challenges associated with handling thin wafer and maintaining package co-planarity have been overcome to stack thin dies (200 µm) on ultra-thin interposer. Improved electrical performance and the advantages of this innovative thin interposer are...
Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller...
In a recent LSI, IR drop on power supply lines is a significant problem for high speed operation, along with an increase of power consumption. In addition, relaxing external stresses during assembly processes is also a serious issue, because more fragile low-k materials are applied to interlayer dielectric films. In this paper, we have developed new structures without adding global interconnect layers...
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