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We report enhancement-mode $\beta $ -Ga2O3 (BGO) MOSFETs on a Si-doped homoepitaxial channel grown by molecular beam epitaxy. A gate recess process is used to partially remove the epitaxial channel under the 1-$\mu \text{m}$ gated region to fully deplete at ${V}_{\textsf {GS}}= 0$ V. BGO MOSFETs achieve drain current density near 40 mA/mm and ${I}_{ \mathrm{\scriptscriptstyle ON}}/{I}_{ \mathrm{\scriptscriptstyle OFF}}$ ...
Recent advances and new trends in high voltage SiC based MOSFETs are analyzed. The main focus is done on design optimization strategies for reducing the on-state resistance. Gate oxide treatments for improving the interface quality resulting in a lower channel resistance are reviewed as well as solutions for lowering the JFET and bulk resistance components. The 3rd quadrant operation, short-circuit...
In this paper, the effects of nanowire (NW) line-edge roughness (LER) in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) are investigated by 3-D statistical simulation in terms of both performance variation and mean value degradation. A physical model is developed for NW LER induced performance degradation in SNWTs for the first time. The results indicate large performance mean value degradations...
Gate misalignment and process variations are important challenges in sub-20 nm gate length planar double-gate (DG) MOSFET devices. For the first time, we demonstrate a misalignment- and process variations-aware device optimization strategy for a DG-MOSFET. Using underlaps and high-kappa offset-spacers, we show that the robustness of the device to gate misalignment and process variations can be improved...
In this paper, we present a FinFET compact model and its associated parameter extraction methodology. This explicit model accounts for all major small geometry effects and allows accurate simulations of both n- and p-type FinFETs. The model core is physics-based (long-channel model) and some semiempirical corrections are introduced in order to accurately simulate the behavior of ultrashort (L = 25...
We report on a 65 nm Ge pFET with a record performance of Ion = 478muA/mum and Ioff,s= 37nA/mum @Vdd= -1V. These improvements are quantified and understood with respect to halo/extension implants, minimizing series resistance and gate stack engineering. A better control of Ge in-diffusion using a low-temperature epi-silicon passivation process allows achieving 1nm EOT Ge-pFET with increased performance.
The extraction of the trap density on Ge/gate-stack (top) and Ge/BOX (bottom) interfaces of germanium-on-insulator pMOSFETs is shown using the Lim & Fossum model historically developed for fully depleted SOI devices. The doping and the thickness of the Ge film do not change significantly the top interface trap density. The bottom one is slightly raised by doping the Ge film. This method can be...
The parasitic resistance of the FinFET is investigated by the measurement based analysis. The RS/D model suggests that careful optimization as to the NiSi incorporation is necessary for the effective Rp reduction. The Rext seriously increases the Rp for TfinLt25 nm and also causes the Rp variability due to the Tfin variation.
We have presented the high performance pMOSFET with embedded SiGe (eSiGe) technique which is applicable to 32 nm node ground rule (dense gate space). In general, close eSiGe S/D structure to the channel improves pMOSFET performance because of higher strain in the channel. However, we found the relation between boron diffusion modulation in SiGe region and short channel effect (SCE) in the context...
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