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This paper presents time-domain reflectometry (TDR) as a nondestructive sensing method for interconnect failure mechanisms. Two competing interconnect failure mechanisms of electronics were considered: solder joint cracking and solder pad cratering. A simple theoretical analysis is presented to explain the effect of each failure mechanism on the TDR reflection coefficient. Mechanical fatigue tests...
Unlike other electronic component manufacturers, many LED manufacturers do not provide board-level thermal cycling test results as a part of the part information. The users of LEDs need to determine the durability of solder joints under their application conditions and circuit board material and geometry. Simulation of solder joint reliability can help system developers to make design decisions. The...
The ever increasing power density in high performance microelectronic devices for large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid array (BGA) solder joints under heatsink compressive loads. In this study, the effect of heatsinking compressive load on the...
The effects of material properties modeling on the solder failure analyses by numerical simulations are studied. The packaging structure of plastic ball grid array on printed circuit board was modeled. Two different types of molding compounds and two different types of substrates were employed and combined for the plastic ball grid array package modeling. The material properties were assumed as temperature...
Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is beneficial in cost and space saving. This study conducts the assembly of the PoP component through the stacking process. Samples are subject to thermal cycling test condition, 0°C to 100°C. The failure of samples is defined as when the measured resistance...
Pad finish is the direct interface between PCB and solder ball, it plays an important role in determining the compound and characteristics of IMC formed at those interfaces, and even to change the mechanical property and microstructure of bulk solder joint. In this paper, we investigated the reliability property of 10 different pad finish combinations. The substrate finish includes electro-plated...
The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic...
The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20°C to +100°C with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer...
The following topics are dealt with: solders; electronics packaging; LTCC layers; power semiconductor devices; wire bonding; printed circuit board; LED; electronic module reliability; CMOS integrated circuit design; sensors; antennas; electric engineering education; and radio network.
This paper describes the thermo-mechanical design of an advanced zero-level capping technology used for packaging of a MEMS die. The package approach uses Intermetallic Compound (IMC) bonding to seal the MEMS die with a cap, and uses Through Silicon Via's (TSV) to provide the electrical connections from the MEMS die to the second level substrate (LTCC or PCB). Advanced FEM based thermo-mechanical...
This article describes preparation of vibration experiments aimed at the reliability of joints manufactured using leadfree soldering and electrically conductive adhesives. To facilitate the experiment, a holder for experimental circuit board had to be designed and manufactured. At the same time, it was needed to set up measurement of acceleration of the specimens to ensure controlled conditions and...
Board level solder joint reliability was evaluated using a 4-point monotonic bending test on different BGA package assemblies, including a 51 ?? 51 mm 2400 CBGA and a 40 ?? 40 mm 1517 PBGA. The edgebond epoxy was applied between the package samples and solder-attached printed wiring boards (PWBs). During the bending test, the PWB strain, bending force and daisy-chain resistance were monitored in real...
A complete halogen-free test vehicle was achieved by assembling five ball grid array (BGA) components with daisy-chain on an 8-layer high density interconnection (HDI) printed circuit board with a low-halide Sn1.0Ag0.5Cu (SAC105) Pb-free solder pastes for reducing the formation of Ag3Sn. Afterward a board-level cyclic bending test was enforced on the as-reflowed assemblies according to the JESD22-B113...
Flash gold with nickel and gold plating is a low-cost technique in PCB finishing, frequently used in the production of toys. The quality of plating has become one of the concerns for the performance and reliability of solderability. This study investigates the solderability of PCB produced by flash gold finish and traditional nickel and gold plating finish. For this purpose, solderability tests have...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free, which leading to challenge in many aspects. It is accepted that nitrogen can improve the wettability and reliability of lead-free solders; however, few systemic researches have been reported. In this work, the spreading ratio of Sn-Ag-Cu solder was measured through spreading tests under different atmosphere...
This paper presents an investigation on field returned open and short failures related to printed circuit board (PCB), including via hole crack, prepreg crack and insufficient circuit etching. After an experimental study with cross section, time domain reflectometry (TDR), and finite element (FE) modelling, it was found that weak plating and corrosion induced via hole crack was a major root cause...
Goldmann Constants and Norris-Landzberg acceleration factors for lead-free solders have been developed based on principal component regression models (PCR) for reliability prediction and part selection of area-array packaging architectures under thermo-mechanical loads. Models have been developed in conjunction with Stepwise Regression Methods for identification of the main effects. Package architectures...
More and more reliability and quality problems of electrical assemblies have to be solved due to the trend of miniaturization and the even higher level of integration. In some cases these failures can lead to catastrophic failure. The phenomenon of electrochemical migration is one of the most dangerous failure mechanism which usually results in short resistive circuits. In this paper electrochemical...
Stiffness of printed circuit boards (PCB) has a great impact on reliability of solder joints. Vibrations or external stress loading lead to stress accumulation within solder joint area. Depending on intensity, inducted stress can be relieved by creep or fractures of solder joint. Intensity of inducted stress depends on loading conditions as well as properties of joined materials (specially stiffness...
The excessive growth of intermetallic compound (IMC) and the formation of microvoids in the interface between Sn-Ag-Cu (SAC) solder and Cu substrate have been a serious problem which may degrade the solder joints reliability. Recently, a new Cu-Zn alloy solder wetting layer for the Pb-free solders has been developed to reduce the IMC growth rate. In this paper, the kinetics of IMC growth and the shear...
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