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Popcorn failure in Hyperelastic-plastic electronic packages under thermal load and Moisture is studied. Using the theory of finite deformation, we obtain the analytical relation between void growth and the sum of the vapor pressure induced by moisture and thermal stress induced by heat mismatch. Numerical analyses show that the critical traction decreases with decreases of yield stress-shear modulus...
The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic...
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