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Popcorn failure in Hyperelastic-plastic electronic packages under thermal load and Moisture is studied. Using the theory of finite deformation, we obtain the analytical relation between void growth and the sum of the vapor pressure induced by moisture and thermal stress induced by heat mismatch. Numerical analyses show that the critical traction decreases with decreases of yield stress-shear modulus...
In this paper, creep behavior of the lead-free SnAgCu solder alloy after reflow process was investigated by use of Nano Indenter XP technology. Based on the steady-state power law creep relationship, the creep strain rate sensitivity exponent was determined from the indentation creep testing using dimensionless analysis method. Then, combining numerical simulation with dimensional analysis, the value...
The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic...
The paper presents a new point that Abrasive Flow Machining is first applied in cleaning the leftover such as copper on the abdominal wall of the steel tube. Analyze the principle of removing copper stains theoretically, the mechanical model of the removal of copper by abrasive is derived in detail. Automatic cleaning mechanism based on AFM and its system are designed, and the suitable technique parameters...
Lamination failure as ldquopopcornrdquo form of plastic electronic packages under thermal stress induced by heat mismatch and vapor pressure induced by the moisture during the solder-reflow process is studied. When plastic electronic packages are made of thermohyperelastic materials, using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained a...
In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be Valanis-Landel hyperelastic materials. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained an analytical relation between the...
The purpose of this paper is to study the combined effect of moisture absorption and void growing on the reliability of electronic packaging. Finite element simulation on a plastic PBGA package was carried out for moisture history from the moisture preconditioning (85 degC / 85 % RH for 168 h) to subsequent exposure to a lead-free soldering process, and the rule of moisture diffusion and the change...
In this paper, a new methodology to extract the elasto-plastic properties of lead-free solder materials from an instrumented sharp indentation loading curve has been proposed using dimensional analysis and finite element computation. The nano indenter XP technology is used to test samples of lead-free eutectic SnAgCu solder alloys to obtain a load-displacement curve, which can be used to calculate...
In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be transversely isotropic and its strain energy includes a power-law reinforcing model has been analyzed. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic...
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