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In many communications applications semiconductor devices operate in a pulsed mode, where rapid temperature transients are continuously experienced within the die. We proposed a novel junction-level cooling technology where a metallic phase change material (PCM) was embedded in close proximity to the active transistor channels without interfering with the device's electrical response. Here we present...
Unlike other electronic component manufacturers, many LED manufacturers do not provide board-level thermal cycling test results as a part of the part information. The users of LEDs need to determine the durability of solder joints under their application conditions and circuit board material and geometry. Simulation of solder joint reliability can help system developers to make design decisions. The...
Flip-chip packages are currently used for various applications such as desktop computers, servers, gaming, telecommunications, etc. Due to tremendous demand of die functionality, the power levels and more importantly the die heat-flux densities are drastically increasing, thus customers are constantly pushing packaging industries to lower thermal impedance of TIM for very high power flip chip packages...
The following topics are dealt with: thermal interface materials; device level thermal management and LED cooling; single phase liquid cooling; data center cooling and phase change materials; two phase liquid cooling; thermoelectronics and refrigeration; heat pipes; heat conduction; transient heat transfer; chip cooling and stacked dies; reliability; microfluidics; and nano-enhanced thermal management.
This paper presents the development of wafer level embedding process for a three dimensional (3D) embedded micro wafer level package (EMWLP). Wafer level embedding process was carried out by using compression molding machine and low-cost granular epoxy molding compound (EMC). Various molding process parameters such as molding time and temperature and three EMCs of different CTEs were analyzed to achieve...
When junction temperatures of the light emitting diode (LED) chips packaged inside LED lamps exceed their maximal limits, the optical extraction and the reliability/durability of the LED lamps will be jeopardized, therefore, thermal management is very important for high power LED street lamps. In this research, a design and optimization method of horizontally-located plate fin heat sink was presented...
Health management and reliability form a fundamental part of the design and development cycle of electronic products. In this paper compact real-time thermal models are used to predict temperatures of inaccessible locations within the power module. These models are then combined with physics of failure based reliability analysis to provide in-service predictions of crack propagation in solder layers...
Over the past 40 years, the semiconductor industry has exponentially driven cost per function down following the oft stated Moores Law. It is becoming increasingly difficult to scale as we move into the 32 nm and beyond process nodes due both to physics and economics. A lower cost alternative method of scaling is becoming more available in the form of vertical chip integration. Many manufacturers...
In aerospace electrical systems, the design trade off is made by the optimization between 5 main constraints : efficiency, EMI, environment, integration level and reliability. In this paper is presented a power inverter solution that enables a high level of integration and a high level of efficiency. The integration of the power inverter is made in one single module that comprises 3 phase legs and...
Temperature monitoring and management is emerging as an important tool for through-life cost optimization of high reliability power electronic systems. When combined with physics of failure based reliability analysis, such techniques can be employed to provide functions such as life consumption monitoring and prognostic maintenance scheduling. Requisite elements of such schemes are real-time electro-thermal...
Junction temperature typically determines the time to wear-out for a power amplifier, and thermal management affects many critical power amplifier design choices such as packaging, gate pitch, and wafer thickness. Pulsed waveforms create a junction temperature that varies as a function of time. Often the maximum temperature during the pulsed waveform is used to determine the failure rate for a pulsed...
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