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White light-emitting diodes (LED) are widely applied in many fields for its special advantages compared with other light sources. Chip-scale-package (CSP) is one of the hotspots in the research of microelectronics, and also the main stream and development direction to the future package technology. Within a CSP, the solder layer between LED chip and substrate is usually achieved via reflow processes...
Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module...
Wafer Level Packaging (WLP) has the highest potential for future single chip packages because the WLP is intrinsically a chip size package. The package is completed directly on the wafer then singulated by dicing for the assembly. All packaging and testing operations of the dice are replaced by whole wafer fabrication and wafer level testing. Therefore, it becomes more cost-effective with decreasing...
Wafer-level packaging (WLP) is essentially a true chip-scale packaging (CSP) technology, since the resulting package is practically of the same size as the die. Furthermore, wafer-level packaging paves the way for true integration of wafer fab, packaging, test, and burn-in at wafer level, for the ultimate streamlining of the manufacturing process undergone by a device from silicon start to customer...
In order to devise an equivalent accelerated moisture sensitivity test, the JEDEC specification J-STD-020C has recommended an accelerated preconditioning time of 40 hrs exposure under 60degC / 60% RH, which is considered equivalent to the standard moisture sensitivity level 3 (MSL-3) of 216 hrs soak time under 30degC / 60% RH. However, the existing methodology for the accelerated moisture sensitivity...
Wafer-level dicing tape format die-attach (DA) film and the corresponding lamination method provide a suitable solution for handling thin-wafers. However, such die-attach films typically have a Young's modulus less than 10 MPa at soldering reflow temperature (e.g. 260degC). This introduces a new failure mode, i.e., cohesive failure in the DA film. Through extensive experimental DOE studies described...
Bismaleimide-triazine (BT) resin/glass fiber laminates are commonly used as a substrate core material in microelectronic packaging. Their moisture absorption and diffusion behavior have a significant impact on package reliability. The traditional method to determine moisture absorption relies on a weight gain measurement metrology with an analytical balance. This approach is generally not suitable...
A key challenge in the development of ultra-thin stacked die chip scale packages is to meet package performance requirements without delamination. Interfacial delamination and cohesive failure are particular concerns. The root cause of this type of failure is difficult to discern, even with extensive root cause analysis and focused DOEs. Through comprehensive simulation and material characterization,...
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