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Predominant high melting point solders for high temperature electronics contain lead (Pb), which will soon be banned by environmental regulations as in most of consumer electronics. In an effort to replace the Pb-based solders with a new high-temperature capable material, we developed a transient liquid phase (TLP) bonding of bismuth (Bi) and nickel (Ni). A molten Bi (m.p. of 271°C) strongly reacts...
Predominant high melting point solders for high temperature electronics (operating temperatures from 200 to 250˚C) are Pb-based but these are hazardous to environment. In this study, we designed and characterized the ‘new’ Bi-based solder alloys, 78Bi-14Cu-8Sn and 70Bi-20Sb-10Cu, to understand their performance for high temperature die attach applications. The specific alloy compositions were determined...
The performance of solder joints in an accelerated thermal cycling (ATC) test depends on the accumulation of fatigue damage, which is affected by various simultaneously evolving microstructure features. A mechanistic understanding of microstructure evolution and damage accumulation in Pb-free solder joints will help us better interpret thermal cycling test results. In this study various components,...
The wear out of lead-free solder joints under realistic loading conditions has been shown to deviate strongly from predictions based on current damage accumulation models. We argue that the deviation must be due to the simultaneous evolution of solder properties and damage. In general, solder properties and fatigue behaviors are determined by microstructure and damage accumulation mechanisms. Literature...
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