The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Predominant high melting point solders for high temperature electronics contain lead (Pb), which will soon be banned by environmental regulations as in most of consumer electronics. In an effort to replace the Pb-based solders with a new high-temperature capable material, we developed a transient liquid phase (TLP) bonding of bismuth (Bi) and nickel (Ni). A molten Bi (m.p. of 271°C) strongly reacts...
Predominant high melting point solders for high temperature electronics (operating temperatures over 200°C) are high Pb containing alloys. The new regulation will have banned the use of Pb in all electronics by 2019. We designed a "new" class of solder alloys with high bismuth (Bi) content (≥ 70 wt.%) to evaluate their potential as a high temperature Pb-free solder. Although having...
Predominant high melting point solders for high temperature electronics (operating temperatures from 200 to 250°C) are Pb-based but these are hazardous to environment. In our previous study, we have shown the alloy design and characterization of the ‘new’ bismuth (Bi) - based solder alloys; 78Bi-14Cu-8Sn, 70Bi-20Sb-10Cu. It was shown that these solders have strong reactivities with Ni (forming intermetallic...
Predominant high melting point solders for high temperature electronics (operating temperatures from 200 to 250˚C) are Pb-based but these are hazardous to environment. In this study, we designed and characterized the ‘new’ Bi-based solder alloys, 78Bi-14Cu-8Sn and 70Bi-20Sb-10Cu, to understand their performance for high temperature die attach applications. The specific alloy compositions were determined...
Thermal interface materials (TIMs) are particulate composite materials widely used in the microelectronics industry to reduce the thermal resistance between the device and the heat sink. Predictive modeling using fundamental physical principles is critical to developing new TIMs, since it can be used to quantify the effect of polydispersivity, volume fraction and arrangements on the effective thermal...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.