Search results for: Brian Roggeman
Microelectronics Reliability > 2013 > 53 > 2 > 303-313
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 3 > 430 - 440
Microelectronics Reliability > 2013 > 53 > 2 > 303-313
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 3 > 430 - 440