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In this paper, a slot type high impedance surface and a mushroom type high impedance surface are applied respectively for the noise reduction inside the shielded package. A simple and efficient modelling method is proposed for the high impedance surface design. A commercial chip with its package is employed to show the performance of the proposed high impedance surface. Both simulation and measurement...
A method is presented to get the distributed characteristic of impedance and the locations of decoupling capacitors on power-ground(PG) planes for minimizing the impedance design. Multi-port networks method based on the integral equation is proposed to model the PG pair with voltage regulator module(VRM) and decoupling capacitors, the distributed characteristic of impedance is analyzed by ports reduced...
To eliminate the noise propagation between the power and ground planes, we propose a method by applying absorbing materials in the package. In the proposed method, absorbing materials are placed on different locations between power and ground planes to verify and compare their performance of noise reduction. From the simulation results, the absorbing materials placed along the boundary of power and...
Power and ground planes are the major noise sources in the electronic package and multi-layered printed circuit boards. We propose a novel imaging method to simulate the impedance of power and ground planes. In the proposed method, the noise propagation between the power and ground planes is equivalent to a two-dimensional transverse magnetic problem. The electromagnetic wave multi reflections from...
Simultaneous switching noise (SSN, also called delta-I noise) has become a tremendous challenge to the reliable operation of high speed electronic circuits. Etching narrow slots on the power or ground plane is one of the efficient techniques to isolate the SSN. A new method for modeling SSN of power-ground planes with narrow slot is proposed in this paper. Firstly, the gapped power-ground planes characteristic...
This paper introduces a method to design the external electromagnetic interference (EMI) filters for switching power supplies. The thesis expounds theory and calculates the filter insertion loss, then analyses the impact of the source impedance and the components model on insertion loss. According to the conducted EMI waveform of switching power supply, we make the corresponding EMI filter, and verify...
In this paper, we propose a novel design of embedded filter for the noise decoupling between power and ground planes. At its isolation band, this compact filter provides a short path for the return current of the signal. Therefore, it prevents the propagation of the digital switching noise along the power distribution network, and improves the power integrity. This embedded filter provides the noise...
The radiation from a power-ground planes structure in high-speed printed circuit boards due to high switching noise current is investigated in this paper. A 2D contour integral method is used to characterize the radiation from the power-ground planes. The contour integral method can model an arbitrarily shaped power-ground planes pair more efficient than 3D numerical methods. By combining the noise...
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