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A new configuration of an integrated circularly (CP) polarized microstrip antenna array operating in Ka-band is presented in this paper. The array consists of 4×4 miter-corner-cut patch elements and is fed by a mixed feeding network consisting of microstrip line and laminated waveguide based on LTCC technology. The rotated corner-cut arrangement is applied to each 2×2 sub-array for increasing the...
A simple UHF RFID circularly-polarized reader antenna is presented in this paper. Air-substrate patch antenna is used to design. Truncated patch structure and shorted posts are used to obtain circularly-polarized characteristic. Measured results show that the antenna with size of 254∗254∗18 mm, has an impedance bandwidth of 880–960 MHz for voltage standing wave ratio (VSWR) less than 1.5. Moreover,...
In this paper, we present a 60-GHz helical antenna element fabricated using low temperature co-fired ceramic (LTCC) technology. The flexible via hole distribution is fully utilized to achieve a planar helical antenna in LTCC to obtain wideband circular polarization performance. The grounded coplanar waveguide (GCPW) to stripline (SL) transition is utilized for probe station measurement.
A 6–18GHz delay line is proposed in this paper. The challenges of delay line design are analyzed and resolved. Based on this, the paper proposes a 6–18 GHz 5-bit delay line by multilayer microwave printed circuit board technology. The measured results show that the delay line has the time delay precision of less than ±6ps, time delay increment of 0.1ns and over delay time of 3.1ns. Small variations...
In this letter, a novel voltage control oscillator (VCO) is proposed and fabricated by low-temperature co-fired ceramic (LTCC) technology. Advanced three-dimensional packaging structure is utilized for size reduction by embedding passive components in multilayer substrate. According to the single π circuit configuration, the models of embedded helical inductors and coupling capacitors are established...
In this paper a 60 GHz antenna-in-package with end-fire radiation in LTCC is presented. Compared with the method mounting the chip on the side of the antenna package, the proposed antenna-in-package (AiP) configuration carries the chip on top of it to greatly save the area of RF front-end. In addition, the symmetric posts are introduced to widen the bandwidth. The metal match rings are added to smooth...
Recently, a new radiation model for the partial element equivalent circuit (PEEC) technique has been proposed. This model makes use of the concept of generalized complex inductance to handle the radiation effect. In this paper, an initial study on a method of deriving a concise and physically intuitive equivalent circuit from such a PEEC-based model is presented. Specifically, the equivalent circuit...
In this paper, a wideband asymmetric Doherty power amplifier (WADPA), which has different LDMOS devices for the carrier and the peaking power amplifiers(MRF7S19080 and MRF8S19140), is designed with the stepped impedance transformer. The carrier and peaking amplifiers of the proposed Doherty amplifier operates in class-AB (2.76V) and class-C (1.3V) bias conditions, respectively, with a drain voltage...
A H-LU decomposition-based direct method enhanced second-order Krylov subspace projection based model order reduction (MOR) is presented. The construction of the projection matrix is the most important process in the Krylov subspace projection based MOR where an inverse of the sparse matrix is involved in the construction of the projection matrix. It will be intractable for the computational capacity...
A low-profile, wide impedance and CP bandwidth microstrip patch array has been designed and tested for INMARSAT system at L-band in this paper. The antenna meets the electrical performance requirement by using dual-fed, parasitic patch and sequential feeding technique in the array design, and the use of coplanar feed for microstrip patch array leads to constructional simplicity and low cost. The design...
Modelling of a pair of annular TSVs is performed in this paper. A set of equivalent lumped-element circuit models for two annular TSV interconnects is proposed, with MOS capacitance effects treated appropriately. The method for characterizing its frequency- and temperature-dependent RLCG parameters is proposed, including its effective capacitance and conductance. The characteristic impedance and insertion...
With the rapid progress of electronic and information technology, body area network (BAN) has been widely used for biomedical monitoring systems using the human body as a transmission medium. In this paper, the effect of the type of arm models on electric field distribution and attenuation constant of on-body transmission have been investigated. In order to assess the sensitivities of the transmission...
Multilevel signaling, such as pulse amplitude modulation (4-PAM), has been actively surveyed in the band-limited channels with sharp frequency roll-off. Due to the longer symbol period, multilevel signalling requires a lower channel bandwidth and offers a better spectral efficiency. This paper discusses a different type of multilevel modulation — double-edge pulsewidth modulation (DPWM), which encodes...
In this paper, we propose an analytical model for predicting the EMF intensity from the circular coil in WPT systems while the current flows through the coil. Assuming the coil is a filament, we then calculate the magnitude of B-field of the circular coil from the vector magnetic potential. Through 3D EM simulations, it is verified that the proposed model well predicts the EMF intensity at various...
Numerical study is performed for an effective suppression of temperature rise in AlGaN/GaN high electron mobility transistors (HEMT) using our developed algorithm based on finite element method. Such a HEMT can be fabricated on SiC or other substrates with graphene inserted between the AlGaN and the GaN layers. The effects of both geometrical and physical parameters of the structure on the maximum...
Three dimensional integrated circuits (3D ICs) have attracted much interest in the recent past, because of their capabilities for more efficient device integration and faster circuit operation. 3D integration relies on through silicon via (TSV) interconnection and interlayer bonding between the silicon layers. Because 3D IC is vertically stacked, higher temperature as well as temperature concentration...
This paper proposed a measurement method of interferences suppression for on-site radiation emission test. This method firstly acquires the multi-channel receiving data, then the DOA of EUT radiated signal and other interference signals can be achieved by MUSIC spatial spectrum estimation technique. And MVDR beam-forming algorithm was taken to form the beam pattern nulls in the direction of the interference...
We recently explored the concept of using BER-optimal ADCs for high-speed links. In this paper, we study the benefits of BER-optimal ADCs in terms of power savings and relaxation of component specifications in a 90 nm 1.2V CMOS process. These analyses are based on component models for a flash ADC that capture bandwidth limitation of pre-amplifiers and metastability of latches. We show that in the...
A meandered microstrip transmission line based ID generation circuit for chipless radio frequency identification (RFID) tag is presented. The ID generation circuit has been designed using microstrip transmission lines as delay lines for its operation at ultra high frequency (UHF:915MHz). The proposed scheme, after receiving a sinusoidal interrogation input pulse, constructs an on-off-key (OOK) modulated...
In this paper we present two algorithms for capacitance and high-frequency impedance extraction for on-chip and on-package interconnect in the presence of random geometrical variations due to uncertainties in the manufacturing processes. The first algorithm, stochastic model reduction algorithm (SMOR), falls under the category of sampling based methods, also known as non-intrusive methods. The second...
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