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In this paper, we present a bidirectional interruption-free multimode waveguide coupler for optical bus systems on board and module level. The principle is based on directional core–core coupling and allows for adjustable coupling powers by tuning the overlap area. By adding a bending to one of the coupling partners, it is possible to obtain specific asymmetric coupling rates depending on the coupling...
This paper describes advances in integrated ultra-thin wireless power module components for Internet of Things (IoT) and wireless sensor applications. A typical wireless module integrates both an inductive link for wireless power transfer, and supercapacitor as a storage element. The performance of the inductive link is enhanced with innovative high-permeability and low-loss magnetic films for improved...
This paper describes an ultra-thin, low cost 3D glass sensor packaging platform for near-hermeticity with novel feedthrough and encapsulation technologies. Glass panels of thicknesses ranging from 50 µm to 300 µm are used which limits overall form factor to 10 MPa) and Dow Chemical's Benzocyclobutene (BCB) 14-P005 is found to be the best candidate for panel level glass-glass bonding. Modelling of...
This paper focuses on packaging and miniaturization of ozone sensors and review aspects of their heterointegration together with other physical sensors for consumer electronics (CE) and internet of things (IoT) applications. We present a concept and simulations of an optically regenerated gas sensor for ozone detection [1]. A demonstrator of innovative stand-alone miniaturized gas sensor according...
This paper describes advances in integrated ultra-thin wireless power module components for Internet of Things (IoT) and wireless sensor applications. A typical wireless module integrates both an inductive link for wireless power transfer, and supercapacitor as a storage element. The performance of the inductive link is enhanced with innovative high-permeability and low-loss magnetic films for improved...
Goal of the presented work is the development of an optical bus-coupler, which enables easy connection between two waveguides without interrupting the bus. It is possible to realize optical bus systems by connecting several modules onto one waveguide with a core-core-coupler. In this paper we present the concept of a bus-coupler, which is suitable for a bidirectional coupling with a definable ratio...
The main package technologies for fiber coupled lasers are single emitter packages such as modified TO-packages or High Heat Load packages. In both cases, the packaging costs are significantly higher than the costs of the single laser diode. Furthermore, the scalability of the optical output power is only possible by varying the input current. Due to the characteristic curve of a laser diode this...
This paper discusses technology development for integration of parallel optical interconnect on board-level. The interchip link is based on planar polymeric optical multimode waveguides and wafer-level out-of-plane coupling optics. Realized on-board waveguides feature low insertion loss with minimum attenuation coefficient of 0.024 dB/cm. Integration of polymeric waveguides on flexible substrate is...
This paper presents the biocompatible packaging technology of a flexible, miniaturized and wireless pressure sensor device which is connected to a stent graft to monitor the pressure distribution within an aneurysm. The packaging of implantable electronic devices has to comply with several requirements regarding their reliability and biocompatibility especially for long term implants. Building up...
In this study we present packaging techniques for SD-card form factor test adapters. Our test adapters consist of FET-based biochemical sensors and a CMOS integrated analog multiplexer connected to a printed circuit board (PCB). Protection of the test adapter is required for long term stability and reliable measurements of the biochemical sensor in a liquid environment. Two different encapsulation...
This paper presents sensors and imaging methods for the detection of orthopedic hip implants loosening. Within orthopedic surgical practice one of the major applications is the reconstructive joint replacement. The hip is used to be the most replaced joint. Although considered an excellent surgical procedure, it can be complicated by implant particle-induced osteolysis (bone resorption) followed by...
As widely known the implementation of lead-free processes induced some thermo-mechanical disadvantages. Although a lot of components do have lead-free interfaces, they are not qualified for the standard lead-free reflow soldering process due to the high peak temperatures during the soldering process. Those components have to be processed by special soldering processes like selective soldering, manual...
In this paper we present the developed components and the electronic packaging design for a miniaturized, wireless neural electrode. Particularly, the whole system consists of a hook-up electrode for contacting the nerve and an electronic part that generates and sends stimulating signals to the nerve and records the neural signals. The hook-up electrode has been designed in a way that enhances the...
Biocompatible polymers used as encapsulation and packaging materials for implantable electronic devices have to comply with numerous requirements. Especially their barrier properties against water molecules and ions are of particular interest regarding the reliability of the encapsulation as well as functional integrity of the electronic components since water and ions on the circuit board may evoke...
For sensor systems and data communication, electro optical integration technologies are an auspicious alternative to conventional electronic system integration. To make the photonic integration more attractive compared to electronic integration technologies, packaging concepts are required which are suitable for mass production using standard processes of the electronics packaging. In this paper,...
Standard surface mount technology (SMT) components based on ceramic bulk body's have been found to be damaged during the assembly process. Mechanical cracks within the components are one possible damage mode. This has been discussed in literature (see [1]). These cracks are a rising problem with smaller component sizes and increasing number of used parts per module. Problems become crucial when damaged...
We have developed a methodology to determine local indentation modulus M for films with thickness ranging from several nanometers to several hundreds of nanometers with nano-scale lateral resolution. Our results obtained for silicon oxide as well as porous organosilicate glasses were in a very good agreement with those provided by nanoindentation methods. The method used is the so-called atomic force...
The paper presents a novel bipolar electrode for continuous evaluation and identification of neural dysfunction. The hook-up design realized with a careful choice of biocompatible materials, enhances the easy of implantation and positioning of the electrode during the medical procedure. In this regard, the proposed electrode offers a promising alternative for applications in neural electrical stimulation...
We propose a new teaching module called “Biology for Electrical Engineers” that should help engineering students to understand and apply important biological concepts. Until now, only few educational institutes in the world offer similar training despite an increasing tendency of interdisciplinarity across research activities. The teaching resources will include overviews of important biological topics,...
The aim of this paper is to present the most recent results obtained after conducting a complex experiment designed with the help of the Design of Experiments (DoE) method. The purpose of this experiment is to evaluate the dependencies between the layout design and the production quality of surface mount boards. The last part of this experiment is focused on studying the effects of solder voids on...
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