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This paper introduces a recent work by a joint effort between Air Products and Sikama International on alpha trials of a production-scale furnace for flux-free wafer bump reflow based on electron attachment (EA).
A novel hydrogen activation technology based on electron attachment (EA) is developed for fluxless soldering at ambient pressure and normal soldering temperature. The technology has a potential to be used for a list of applications in the electronics packaging industry.
Nanoprobing techniques have become standard analytical way for real-world device analysis in the modern semiconductor FA lab. The four or six probing of Static noise margin (SNM) and Read noise margin (RNM) could be useful for the SRAM FA. It can justify soft fail and marginal fail to single-bit failure. The in-depth mechanism, completed operation and valuable application are introduced in the content.
Background Neonatal lung injury, a leading cause of morbidity in prematurely born infants, has been associated with arrested alveolar development and is often accompanied by goblet cell hyperplasia. Genes that regulate alveolarization and inflammation are likely to contribute to susceptibility to neonatal lung injury. We previously cloned Lgl1, a developmentally regulated secreted glycoprotein in...
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