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The production of reliable power modules capable of achieving higher power densities and higher junction temperatures is limited by the present assembly and packaging methods, mostly in the areas of the die-attach and the top level interconnections. The resultant bondline consists of intermetallic compounds with higher melting point than the used interlayer material, thus making this technique applicable...
Current developments in power electronics are driving the need for higher operating temperatures. At temperatures above 200 °C conventional solders can no longer be used. Therefore new technologies for Die-Attachment are necessary. One solution is to use diffusion soldering. Khaja et al. [1] presented an approach for diffusion soldering by printing a conventional solder paste with a 20 μm thin stencil...
Several applications require (ultra-)thin and reliable packaging of the sensor electronics. Especially the rapidly increasing use of sensor elements in nearly every field of engineering is the main driver for that fact. One specific application is magnetic field sensors in active magnetic bearings. In order to improve their precision and stiffness those bearings can be beneficially operated by measuring...
The focus of this paper is the development of a suitable thermoelectric cooling solution (TECs) for fiber-coupled laser diodes of an optical power supply by thermal simulation via PSpice or LTSpice. As a first step it was necessary to create a working model of the thermal circuit of the TEC. As a consequence it was possible to simulate an existing cooling system and to evaluate the accuracy of the...
As widely known the implementation of lead-free processes induced some thermo-mechanical disadvantages. Although a lot of components do have lead-free interfaces, they are not qualified for the standard lead-free reflow soldering process due to the high peak temperatures during the soldering process. Those components have to be processed by special soldering processes like selective soldering, manual...
In power electronics there is currently a development to higher operating temperatures of up to 300 °C. This was made possible by an improved availability of semiconductor materials such as silicon carbide. At these temperatures conventional solders can no longer be used for Die-Attachment. Therefore new technologies are necessary. One possible solution is to use diffusion soldering. Khaja et al....
We realized ultra-thin and flexible magnetic field sensors based on the Hall Effect in 2 μm thick Bismuth films prepared on commercial flexible double-layer polyimide PCB with a total thickness of 150 μm. These sensors could be potentially applied in active magnetic bearing (AMB) systems. Therefore, here we address reliability aspects of flexible Hall sensors with emphasis on the proper choice of...
For sensor systems and data communication, electro optical integration technologies are an auspicious alternative to conventional electronic system integration. To make the photonic integration more attractive compared to electronic integration technologies, packaging concepts are required which are suitable for mass production using standard processes of the electronics packaging. In this paper,...
Electronics and microsystems technology are characterized by an ongoing miniaturization and a growing up of complexity of semiconductor components. These trends are described by Moore's Law and the terms “More Moore” and “More than Moore” (see Fig. 1). The most important driver of this development is the respective market of the final products — driven by the costs. In this context the development...
The need for higher operating temperatures in power electronics is driving the research and development on alternative technologies to conventional soldering. One of them is diffusion soldering. Khaja et al. proposed a new approach by printing very thin layers of solder paste. This approach requires a special soldering process to reduce the void content to an acceptable value. Vacuum soldering and...
When exposed to harsh and humid environments, electronic systems can show electrochemical corrosion. One of the possible defects is Conductive Anodic Filament (CAF). This defect needs the presence of humidity. Though the moisture uptake of printed circuit boards has been studied thoroughly, a complete understanding of the diffusion processes and paths in printed circuit boards has not yet been achieved...
In 2002 a new EU directive called 2002/95/EG (RoHS) caused the electronics industries to change their production lines to lead free soldering processes. However, in some cases they are still using the same electronic components which are not certified for the significant higher temperatures of the lead free soldering process. This causes junk that can only be reduced by placing and soldering critical...
Direct converting X-ray line detectors might be a low-cost solution for inline X-ray inspection systems for electronics production and other industries. Possible detector materials are semiconductors in general, in our case GaAs.
In the recent years the number of applications using organic materials has been significantly increased for electronic devices (e.g. organic LEDs or organic solar cells). This results in stricter requirements to reliable substrate and packaging materials for these applications, especially for flexible substrates. Furthermore, this implies new tasks for the qualifying procedures. One requirement is...
The challenges of electronics packaging and system integration require new non-destructive evaluation (NDE) techniques during production processes for fast and reliable detecting of small defects like shorts, missing parts or contacts and voids. X-ray techniques like radiography, limited angle tomography and computed tomography are very important methods. Today the common detector principle for X-rays...
The advantages of copper wire bonding compared to gold wire bonding, such as lower material costs, have led to an increased interest in reliability of copper bonds. The knowledge of the bonded wire microstructure is essential to achieve high-reliability bonding. This study focuses on the metallographic preparation of a bonded cross-sectioned sample for achieving a high-quality planar surface, suitable...
Today non-destructive evaluation techniques become more and more important. Consequently, X-ray detectors are suitable tools to get information about specimens. In comparison to the already established scintillation principle, the direct converting method on the basis of semiconductor materials delivers several advantages. Hence, it is necessary to speed this measurement method and develop appropriate...
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