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System integration takes benefit from 3D stacking technologies in a wide range of applications such as smart imagers, photonics, stacked memories, mobile applications and high-performance computing. Several integration schemes are considered worldwide to address applications specific requirements: performance, cost, form-factor, thermal management or even supply chain availability. This paper presents...
System integration takes benefit from 3D stacking technology in a wide range of applications such as smart imagers, photonic, wide I/O memories and high-performance computing. The 700 mm2 ITAC 3D integration test platform contains a set of “Integrated Technological and Application Circuits” for process development, electrical and RF characterization, reliability, die stacking, warpage and underfilling...
From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and...
Die stacking in 3D integration increasingly deals with smaller soldered joints on flip chips which have to meet reliability requirements especially thermal cycling, vibrations, shocks. Adding an underfill between stacked chips is a solution to improve the structural integrity of those joints. In this work, different underfilling techniques are compared in chip to wafer (CtW) approach: one capillary...
This paper is dedicated to the full integration of a new silicone-based material for Molding-Underfilling (MUF) on silicon interposer wafers containing Through Silicon Vias (TSVs) and top dice. The developments were carried out in the frame of “silicon package” where the silicon interposer is either reported on P-BGA or directly assembled on board. After a materials screening with regard to warpage...
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