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The polymer cored solder interconnect has been investigated in board level strain concerned ball grid array type IC package for many years. The novel solder ball with a polymer core is designed to compensate the board level reliability weakness of current metal alloy interconnect such as mechanical and thermal-mechanical fatigue endurance due to its unique spherical polymeric core able to absorb the...
The polymer cored solder interconnect has been evaluated in board level strain concerned ball grid array type IC package for many years. The innovative ball design is developed to compensate the board level reliability weakness of current metal alloy interconnect such as mechanical and thermal fatigue endurance due to its unique spherical polymeric core able to absorb the strain energy generated during...
In recent years, the data center reliability is paid more attention due to in cloud computing application. In general, the longer term reliability requirement is concerned for it than in general products when in service life. With the more and more severe environmental pollution, the air quality will also directly or indirectly influence the life of data center wherever indoor and outdoor. The air...
In the paper, the ion bombardment skill was adopted in analyzing various lead free solder microstructures to compare Ag effect, Cu effect as well as Ni dopant addition effect by way of following SEM observation. The ball grid array package attached with lead free ball is subject to SMT with lead free (SAC387) paste on the PCB. After mechanical polishing, the test vehicle is further subject to ion...
In recent years, the data center reliability is paid more attention due to in cloud computing application. In general, the longer term reliability requirement is concerned for it than in general products when in service life. With the more and more severe environmental pollution, the air quality will also directly or indirectly influence the life of data center wherever indoor and outdoor. The air...
98.5Sn0.5Ag1Cu0.05Mn (SAC0510M) exhibits a melting behavior similar to SAC105. It is two times better than SAC105 in the dynamic bending test; more than 8 times better in the modified JEDEC drop test; and more than 40–60% better in the −55°C/125°C thermal cycling test. The reduced hardness and much thinner and stable IMC layer on Ni are responsible for the superior non-fragility, while the stabilized...
In the past few years, QFN packages with large body sizes and multi-row external terminals as well as small body devices with ultra-fine pitch pads have emerged as a cost & performance competitive alternative to other BGA style packages, particularly for small form factor products. Due to pb-free and halogen free conversion requirements, green (environmentally friendly) molding compounds have...
Counterfeit components have become a multi-million dollar, yet undesirable, part of the electronics industry. The profitability of the counterfeit industry rests in large part to its ability to recognize supply constraints and quickly respond, effectively taking advantage of a complex and vulnerable supply chain. Events like product obsolescence, long life cycles, economic downturn and recovery, local...
QFN (Quad flat no-lead) package has become a necessary IC package type covering low cost and high performance needs throughout consumer, telecommunication (wireless handset, power management, analog baseband and Bluetooth) to high end electronics product application due to its small form factor and excellent thermal and electrical performance compared to similar size IC package [1]. With more and...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. The result shows the strain-controllable dynamic bending method can...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.
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