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Prediction of radiation from multilayer circuit boards is an important problem which is of interest to the design of digital system such as servers. In particular, signal mode conversion as the result of undesired imbalances in the board interconnects plays a significant role in the generation of noise emission. In this paper, we investigate methods for modeling common/differential mode conversion...
There is an increasing need for improved node density and better power efficiency in telecommunication market. In addition, the telecommunication server environment also requires rugged high system performance systems with compliance to rigorous standards. Hence, the design of telecommunication blade servers presents several conflicting electrical and mechanical parameters in terms of desired transmission...
The design of telecommunication blade servers presents several conflicting electrical and mechanical parameters in terms of desired transmission frequencies, blade density, energy consumption, and total cost. This paper presents the design challenges and their effective resolution encountered in the design of a high frequency system. A comprehensive modeling and simulation technique is presented that...
In modern data centers, rack mount equipment provides ease of planning, installation, and management due to the standardized form-factors that multiple vendors follow. Within a single server or a blade environment, the predominant form factor is the backplane where multiple cards communicate through connectors. Within a rack, one or multiple servers may be installed and communication between racks...
Today's high speed electrical systems exhibit ever increasing complexity generation after generation. This increased complexity results in additional design parameters which the system designer must choose carefully to obtain the optimum design. Often, the number of these design variables is large enough that a brute-force search of the design space is not feasible. Statistical techniques like design...
This paper presents a Full-Wave FEM simulation technique for the shield wrap discontinuities that result in a `suckout' effect in TwinAx differential cables.
This paper presents modeling and simulation utilizing a parallel conformal finite-difference time-domain (Yu and Mittra, 2003) code developed at the Electromagnetic Communication Laboratory, Pennsylvania State University, on a massively parallel supercomputer. Parallelization, scalability, and application to the modeling of high-end server electrical interconnects are examined.
Processor, memory, and I/O are three important segments in today's high-speed server platforms. Doubling of processor speed almost every two years and recent advancements in processor performance by developments such as multi-core processing and simultaneous multi-threading (SMT) have resulted in an imbalance in the three segments. With the introduction of serial I/O technologies like PCI express...
High-end computing servers configured as symmetric multi-processor (SMP) systems rely on parallel high speed links for interconnection between the processors. With each new generation of processor, the bandwidth of the SMP link is increased. Wired copper cables are still the technology of choice for this application but with each increment in bandwidth, fiber optic interconnects become more competitive...
Most high data rate PCBs has many layers. Signals can change layers with many different configurations, and often have long stubs. All these options can have different effects on the signal, and need to be properly simulated. This paper describes the initial efforts to develop a strategy to properly analyze these complex structures by first modeling a simple via structure where a signal trace changes...
Increased demand for performance continues to drive higher chip internal clock frequencies and parallelism, as well as raise the demand for higher bandwidth and lower latencies. Today's copper digital communication links are limited by their loss characteristic which are dominated at high data rates by skin effects and dielectric loss (Broomall, 1997). Electrical copper links are typically used to...
This paper investigates the role of embedded capacitors in the enablement of future high speed digital systems. Present and future chip core and off-chip clock frequencies impose high demands on the design of the power and signal distribution systems. This requires careful and more effective design techniques at the electronic packaging level to mitigate the increasing power and signal noise jitter...
Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via...
This paper describes the electrical design, packaging and specification challenges for high speed serial link interfaces utilizing clock data recovery and encoding protocols. Major design and modeling issues are discussed, such as attenuation, crosstalk, simultaneous switching, impedance control and intersymbol interference. Channel specification and characterization are important aspects of the total...
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