The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this work an investigation on dynamic stress development during switching operation of power electronic devices is presented. Two measurement techniques were used to analyze the behavior of devices which were mounted withelectrically conductive adhesives. A self-heated silicon test chip with CrNi-thin film strain gauge structures was developed. The heating function enables simulation of thermal...
In industry there is an increasing demand for reliable pressure sensors for applications in harsh environment. Pressure sensors working at high temperatures of 500 °C impose new challenges in packaging due to thermal cross sensitivity and temperature induced stresses on the package. Other major issues are to identify stable materials at high temperature and stress-tolerant sensor mounting techniques...
In the year 2006 a ban of lead containing solders in the EU required the qualification of lead-free solder alloys. However, these do not provide the same characteristics as lead containing solders do. Also their costs are higher due to expensive machinery use and increased tin and silver contents. The aim of our research is to develop assemblies based on electrically conductive adhesives that have...
The flip-chip technology has many advantages over standard wire bonding processes especially as interconnection technique for MEMS operating in harsh environments. In this paper, silver based micro contact bumps are investigated with test assemblies on their reliability for an operating temperature of 500 °C. The contact bump materials are a nano-silver sinter paste and a glass-solder filled with...
To secure power devices to a substrate, solder materials are typically used. An alternative technique to produce silver interconnections by pressure-assisted sintering of micron-sized silver flakes is known as Low Temperature Joining Technology (LTJT). In principle, the LTJT shows a superior electrical and thermal performance compared to solders. In addition LTJT interconnections can be employed at...
The aim of this study was to analyse the stress state in silicon dies joined by Low Temperature Joining Technology (LTJT) based on measurements and simulation results. The focus was to establish a method to determine the initial stress state and stress-free temperature in a silicon die attached to a copper substrate after the joining process. An approach to analyse the evolution of the stress state...
The joint research project MikroSol focuses on electrical and microstructural properties of screen printed front side silver contacts. Special attention is given to the contact resistance of the contacts as well as metallization- induced recombination losses in the space charge region of the solar cell. Differently processed industrial solar cells were characterized by electrical measurements as well...
To evaluate the impact of industrially relevant contact firing parameters on the contact resistance of screen printed front side silver contacts to the n-type emitter of crystalline silicon solar cells, contact firing is performed using design of experiments. Therefore, H-pattern aluminum back surface field solar cells processed on boron-doped Czochralski silicon are contact fired by rapid thermal...
The objective of this study is to develop and investigate a reliable electrical interconnection for SiC-MEMS, which can sustain high mechanical and thermal loads in harsh environments. Platinum and palladium wire bonds, with a diameter of 25 microns, are used for interconnection of sensors with an operating temperature of 500 °C. Silicon testsensors with TiW/Pt bond pad metallization are processed...
Silicon carbide is a promising semiconductor material for sensor applications in harsh environments. To operate SiC-MEMS at high temperature, reliable assembly and packaging technologies are needed. In this paper, packaging technologies for die-attachment and interconnection suitable for SiC-Sensors are presented. They are investigated on their stability, reliability and their thermo-mechanical influence...
Within the framework of the presented project, new mounting concepts for power electronics were implemented by applying Al/Cu coat systems to insulators by means of cold gas spraying (CGS). The layers sprayed with cold gas were investigated and good material properties are observed. The applied metallizations show an extremely small porosity, no thermally induced phase conversions or process-related...
The reliability of BGA packages is primarily affected by thermo-mechanical deformations in the assembly as a consequence of the CTE mismatch of the materials. Typical failure modes are low-cycle fatigue of second level solder joints or delamination of pads from the PCB.
The trends of 3D integration and System-in-Package (SiP) require the adaptation of target preparation methods for failure analysis of these complex integrated devices. Recent improvements in laser-based target preparation make laser cross-sections through several stacked silicon dies possible with remarkably small visible Heat-Affected Zones (HAZs). The distinct removal of Molding Compound (MC), silicon...
In order to optimize the reliability of automotive electronics, comprehensive knowledge of the acting field loads is an indispensable prerequisite. Automotive electronics are exposed to variable environmental conditions with different intensities, frequencies and durations, depending on a car's usage. This paper describes a mobile acquisition system for measuring all relevant field loads including...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.