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Silicon interposers are frequently used in memory and network processor systems to closely integrate multiple chips and improve the performance of high-speed systems. The proximity provided by silicon interposer greatly improves bandwidth, power, and latency by simplifying communication and clocking of the links. However, the design of silicon interposer systems poses new challenges in managing the...
Design of robust power supply system to support DDR4 interface operating at 2400Mbps and beyond requires full consideration of supply noise impact on timing jitter in the system. Using relative jitter for DQ vs DQS and CA vs CK is critical and absolute jitter for CK is critical in optimizing the power supply system and deriving supply noise mitigation strategy.
The power integrity characterization of a high-capacity, compute-server memory system operating at 4.8Gbps-per-link is presented. The design robustness of the low-swing, single-ended signaling is verified as the system has excellent immunity to the noise from simultaneously switching outputs (SSO) and a low power-supply-induced jitter (PSIJ) at the primary chip-package resonance frequency.
A memory system that meets the bandwidth, power efficiency, and capacity needs of future computing systems is presented in this paper. A 6.4 Gbps single-ended DDR memory interface for the controller and the DRAM was designed in a 28-nm CMOS process for a main memory system with dual-rank DIMMs. The architecture features a novel clocking scheme, per-pin timing adjustment, dynamic point-to-point signaling...
The emergence of cloud computing has driven the demand for high-density, low-latency and high-speed memory interfaces. For such applications the use of multiple dual-inline memory modules (DIMMs) with multiple ranks enables time-efficient processing of high-volume data. However, the deterioration of the channel frequency response due to the presence of DIMM connectors and multiple ranks makes it challenging...
A 5Gb/s source-synchronous signaling system was developed utilizing embedded common-mode clocking technology to minimize clock distribution delays and to reduce the total pin count. The common-mode clocking scheme forwards the clock on the common mode of the differential data channels. In addition to the signal integrity issues present in differential signaling systems, the embedded common-mode clocking...
PCB traces in backplane are typically routed as striplines, which create near end crosstalk, but theoretically, no far end crosstalk. However, in practice, both near end and far end crosstalk introduced by via antipads and layer misalignment in the connector pin field due to manufacturing process variations can be significant. This paper presents an analysis for the first time of the PCB trace crosstalk...
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