Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
In this paper, the effect of high-vacuum annealing with crystallinity-damage recovery on mechanical characteristics of Ga-implanted Si nanowires (NWs) fabricated by focused ion beam (FIB) is described. We have specially designed and developed “Beetle-like” tensile test device, presented for the first time, enables us to directly tension 10 ∼ 200 nm-wide Si NWs with high precision. Also, we have established...
Recently, it has been revealed that properties of ferroelectric nanostructures depend on their size. The depolarization field has been considered as one of the major factors, which cause “size effect”. In this study, we investigated the influence of the depolarization field on the domain structure in tetragonal Pb(Zr,Ti)O3(PZT) nanorods. We fabricated PZT nanorods with 100 nm-4µm widths by focused...
In this paper, tension-torsion-bending combined loading test technique for microscale single crystal silicon beam specimens is described. We have designed and developed two types of the multi-deformation loading test apparatuses to investigate the deformation-mode and specimen-size dependencies on the fracture strength. The comparisons among the strength data under different deformation-modes and...
In this study, the size limit of Al/Ni nano-multilayered rectangular cuboids for the self-propagation of their exothermic reaction on a Si wafer was investigated. After Al/Ni multilayer films were deposited on a Si wafer, micro-sized rectangular cuboids were formed from the films using focused ion beam. By applying a small spark to the cuboids, we have tried to make them exothermic reaction. As the...
This paper describes the effects of specimen size, focused ion beam (FIB) damage, and annealing on the mechanical properties of sub-100nm-size silicon (Si) nanowires (NWs) evaluated by direct tensile testing. Si NWs were made from silicon-on-nothing (SON) membranes that were produced by deep reactive ion etching (DRIE) trench fabrication and ultra-high vacuum (UHV) annealing. FIB system's probe manipulation...
In this article, mechanical reliability of solder joints fabricated using Al/Ni reactive film is described. Rectangular solid Si sample with solder-bonded section was prepared for measuring the bond strength using developed four-point bending test equipment. By changing Al/Ni film thickness, interlayer between SnAg solder and Si, and pressure load during bonding, the fracture strength was investigated...
In this article, a new low temperature solder bonding technique using Al/Ni exothermic reactive film is described. Al/Ni reactive film is able to generate heat enough to melt SnAg solder film. During the reaction, the volume is definitely shrunk by 12% because of the changes in crystallographic structure and lattice constant. The volume shrinkage yields cracking in reacted NiAl. In this study we focus...
In this article, a technique for non-destructive stress analysis of thermal silicon-oxide (SiOx) film using cathodoluminescence (CL) spectroscopy is described. The uniaxial tensile tester which can be used in a scanning electron microscope (SEM) chamber was developed to apply tensile stress to the film specimen. CL spectra of SiOx film were measured under various tensile stresses. The peak position...
In this article, the influences of specimen size and deformation-mode on the fracture strength of single-crystal silicon (SCS) micro-beam structures are described. We have designed and developed a new materials test device that is able to apply pure torsion, torsion-bending-combined, and bending deformations to a micro-scale beam specimen. The differences in deformation-mode are determined by loading...
In this article, a new technique for controlling crack position and its propagation direction in solder-bonding using Al/Ni exothermic reaction is described. Sputtered Al/Ni multilayer film is able to produce heat instantly by its self-propagating exothermic reaction, and the reactive film can be used as heat source for solder-bonding. During the reaction, however, volume reduction by approximately...
In this article, the influence of annealing on the mechanical characteristics of sputtered aluminum-silicon copper (Al-Si-Cu) thin films is described. The in-plane biaxial tensile tester developed by the authors was used for uniaxial and biaxial tensile tests in ambient air. In uniaxial test results, the Young's modulus did not depend on annealing, whereas the yield stress was influenced by annealing...
This paper reports the comparison among the results obtained by various types of testing for evaluating fatigue lifetime of silicon specimens, performed in 6 institutions in Japan. The experiment covers a variety of single crystal silicon (SCS) specimens fabricated on the same SOI wafers with 5 μm device layer thickness as well as additional specimens made separately in some institutions. In summary,...
In this study we describe a novel system for measuring the distribution of inhomogeneous mechanical properties of microelectromechanical system (MEMS) devices. Such inhomogeneous properties are important because they can decrease the reliability of MEMS devices. Our technique involves measuring the variation in the relative position and angle between single molecule markers sprayed on a MEMS device,...
In this paper, we describe a new production method for microscale silicon carbide (SiC) ceramics parts. Slip casting with SU8 micro mold was carried out for the fabrication of a three-dimensional SiC MEMS component, which was made from polycarbosilane (PCS) precursor-derived SiC nano powder. SiC nano powder was mixed with a PCS solution. The slips were then cast into SU8 micro mold made on porous...
This paper focuses on evaluating the adhesive strength of silver-tin (Ag-Sn) solder-jointed single-crystal silicon (SCS) specimens. The exothermic reaction in aluminum-nickel (Al/Ni) multilayer film was used as a heat source for melting the solder film. The reaction generated heat enough to melt Ag-Sn film. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point...
This paper describes a quantitative measurement method for Young's modulus of nanometer-thick film materials by using a MEMS resonator array. The MEMS resonators fabricated by silicon micromachining techniques were designed to be driven at their resonant frequencies from 6.0 kHz to 35.5 kHz. From the difference in resonant frequencies between before and after deposition of these films onto the resonators,...
This paper describes the mechanical degradation mechanism of sputtered aluminum-alloy (Al-alloy) film used as a structural material in microelectromechanical systems (MEMS). The environment-controlled uniaxial tensile test system with elongation measurement image analysis function was developed to investigate the material characteristics at temperatures ranging from room temperature (RT) to 358 K...
This paper describes fabrication, characterization, and demonstration of a novel active micro-catheter with Ti-Ni shape memory alloy (SMA) actuators for wide range of forward-looking area to remedy diseased area inside a blood vessel. The developed active micro-catheter consists of eight Ti-Ni SMA spring actuators for catheter actuation, an ultrasonic piezoelectric transducer for forward-looking,...
This paper describes fatigue damage evaluation for micro-nanoscale single-crystal silicon (SCS) structures toward the reliable design of microelectromechanical systems subjected to fluctuating stresses. The fatigue tests, by using atomic force microscope (AFM), nanoindentation tester, and specially developed uniaxial tensile tester, have been conducted under tensile and bending deformation modes for...
This paper describes novel elongation-measurement device utilized for uniaxial tensile test. The device consists of two sets of micro probes with piezoresistive sensor for detection of gauge mark position on specimen, and multiple pairs of bimorph actuators for in-plane motion to scan the gauge mark. The voltage from the sensor is put out by the cantilever deflection when the cantilevers climb the...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.