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The major issue that negatively impacts today's Field Induced CDM (FICDM) tester repeatability and reproducibility is the air discharge's variable spark resistance. There are many variables that contribute to this measurement uncertainty including humidity, pogo shape, DUT shape, contact alignment, surface cleanliness, approach speed, voltage level and adjacent pin discharges. The air discharge variability...
A new tester-induced HBM current waveform anomaly was discovered as a result of efforts to understand the cause of low level HBM failures seen on 65 nm CMOS products. The anomaly, which consists of a current spike occurring just prior to the actual HBM pulse, was found to be caused by contact misalignment in the tester??s discharge relay.
The ESD Associationpsilas Workgroup 5.5 subcommittee is conducting a round robin study to determine the repeatability and reproducibility of measurements made the current VF-TLP Standard Practice. This study involves seven test sites with eleven different test structures evaluated at each site. This paper summarizes these findings to date.
A new Human Body Model (HBM) SPICE equivalent lumped element model (LEM) circuit that reproduces parasitic resistance, capacitance and inductance (RLC) tester effects has been used to investigate how the HBM current flows through several different relay-matrix HBM simulators. SPICE analysis shows that unwanted interaction between the simulators RLC parasitics and the IC component could be significantly...
A previously undetected trailing pulse from HBM testers was found to create unexpected gate oxide failures on new technologies. This secondary pulse, which is EOS in nature, is caused by the discharge relay and the parasitics of the charge circuit. This paper investigates this critical phenomenon and establishes the tester improvements to safely suppress the trailing pulse effects.
HBM and TLP measurements on dynamically triggered CMOS power supply clamps were found to be inconsistent for low leakage clamps. The failures at low HBM voltage were found to be due to a voltage ramp leading up to the HBM pulse which prevented the clamps from turning on.
The ESD Association standards working group 5.3.2 is analyzing the procedure and stress that is applied to a device under test (DUT) using a socketed discharge model (SDM) test system, formerly referred to as socketed CDM. Our final goal is to define an SDM tester specification that will guarantee test result reproducibility across different test equipment. This paper investigates the effect of tester...
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